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NCV7342MW3R2G DFN-8-EP(3x3) The CAN communication interface chip
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Shenzhen Yimaoxun Technology Co., Ltd.
2 yrs
CN
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Key attributes
Other attributes
Place of Origin
Guangdong, China
Brand Name
YMX
Model Number
NCV7342MW3R2G
Application
The CAN communication interface chip
Type
memory_ddr3
Series
ps127 memory card
Description
126tb memory card
Packaging Type
DFN-8-EP(3x3)
Function
phone memory card
Interface
flash memory kingston
Operating Temperature
toshiba memory card
Data Rate
memory foam neck pillow
Package / Case
DFN-8-EP(3x3)
Voltage - Supply
baby pillow memory foam
Current - Supply
memory foam twin mattress
Number of Circuits
memory ddr129
Protocol
electronic components china
Features
dog bed memory foam
Mounting Type
memory card sandisk
Manufacturing Date Code
Refer to the PDF
Cross Reference
mattress topper memory foam
Packaging and delivery
Packaging Details
NB
Selling Units:
Single item
Single package size:
0.1X0.1X0.1 cm
Single gross weight:
0.001 kg
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Lead time
Quantity (packs)
1 - 100
101 - 10000
10001 - 100000
> 100000
Lead time (days)
3
5
7
To be negotiated
Customization
Customized logo
Min. order: 100000000
Customized packaging
Min. order: 100000000
Graphic customization
Min. order: 100000000
For more customization details,
message supplier
Product descriptions from the supplier
99999 - 599999 packs
$0.465
600000 - 8999999 packs
$0.45
9000000 - 10999999 packs
$0.44
>= 11000000 packs
$0.43
Variations
Total options:
Select now
Shipping
Start order
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Membership benefits
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