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Non conductive electronic adhesive glue Epoxy-Based Chip Underfill for PCB chip on board
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Key attributes
Other attributes
Place of Origin
China
Main Raw Material
COB
Usage
Construction, PCB
Classification
Other Adhesives
Brand Name
DeepMaterial
Model Number
DM-6320
Product name
Epoxy-Based Chip Underfill and COB Encapsulation Materials
Material
one-component potting materials
Storage temperature
-20-8℃
Curing method
Heat curing
Color
Black
Use
Low temperature fast curing
Product Description
Suitable for low-temperature curing of heat-sensitive components
Curing system
Heat cured or UV cured
Feature
High temperature stability and heat shock resistance
Glue type
Epoxy resin-based
Lead time
| Quantity (units) | 1 - 1 | > 1 |
| Lead time (days) | 7 | To be negotiated |
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Product descriptions from the supplier
>= 1 units
$25.00
Quantity
Shipping
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$0.00
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$0.00
Subtotal
$0.00
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