All categories
Featured selections
    Trade Assurance
    Buyer Central
    Help Center
      Get the app
      Become a supplier

      One Component Epoxy Resin Adhesive Underfill Compounds For Flip Chip CSP BGA And Micro-BGA Assemblies

      No reviews yet
      Huizhou Junbang Technology Co., Ltd.2 yrsCN

      Key attributes

      Other attributes

      Place of Origin
      China
      Main Raw Material
      Epoxy
      Usage
      Construction, Camera Module
      Classification
      Other Adhesives
      Brand Name
      DeepMaterial
      Model Number
      DM-6320
      Product name
      Epoxy-Based Chip Underfill and COB Encapsulation Materials
      Material
      one-component potting materials
      Storage temperature
      -20-8℃
      Curing method
      Heat curing
      Color
      Black
      Use
      Low temperature fast curing
      Product Description
      Suitable for low-temperature curing of heat-sensitive components
      Curing system
      Heat cured or UV cured
      Feature
      High temperature stability and heat shock resistance
      Glue type
      Epoxy resin-based
      Show more

      Lead time

      Quantity (units)1 - 1 > 1
      Lead time (days)7To be negotiated

      Product descriptions from the supplier

      >= 1 units
      $25.00

      Quantity

      Shipping

      Shipping solutions for the selected quantity are currently unavailable
      Item subtotal (0 variations 0 items)
      $0.00
      Shipping total
      $0.00
      Subtotal
      $0.00

      Membership benefits

      Quick refundsView more

      Protections for this product

      Secure payments

      Every payment you make on Alibaba.com is secured with strict SSL encryption and PCI DSS data protection protocols

      Refund policy

      Claim a refund if your order doesn't ship, is missing, or arrives with product issues
      Alibaba.com protects all your orders placed and paid on the platform with