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QFN DFN QFN SOP TO SOT MSSOP STAMPING AND ETCHING COPPER IC LEAD FRAME
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Zhuhai Fillgold Technology Co., Ltd.
4 yrs
CN
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Key attributes
Other attributes
Place of Origin
China
Brand Name
FILLGOLD
Model Number
DFN 12L 3X3
Type
Silicon Wafer
Product Name
QFN DFN ETCHING LEAD FRAME
Type
QFN DFN
Material
A194/C19210/C194/C7025/C2680
Function
Semiconductor package
Size
Customized OEM
Thickness (MM)
Customized
Process
ETCHING
Max Lead
64 PIN
Max Width
100mm
Surface Finish
AG Plating Sliver / PPF/Roughning
Packaging and delivery
Selling Units:
Single item
Single package size:
20X20X20 cm
Single gross weight:
0.100 kg
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Lead time
Quantity (pieces)
1 - 200
> 200
Lead time (days)
30
To be negotiated
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Samples
Maximum order quantity: 5 piece
Sample price:
$2.00/piece
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Customization
Customized packaging
Min. order: 1
Graphic customization
Min. order: 1
Customized logo
Min. order: 1
For more customization details,
message supplier
Product descriptions from the supplier
100 - 999 pieces
$3.50
>= 1000 pieces
$2.50
Quantity
-
+
Shipping
Item subtotal (0 variations 0 items)
$0.00
Shipping total
$0.00
Subtotal
$0.00
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Samples
Maximum order quantity: 5 piece
Sample price:
$2.00/piece
Order sample
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Quick refunds
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