Compared with the original design, nothing will affect the cost and quality of the PCB. SHINELF hopes to understand your requirements and products. Our technicians are experienced in PCB production, especially how to produce PCB at the lowest cost without compromising design goals. We process Gerber files and customer-specific solutions every day, and can provide suggestions for value engineering and cost reduction plans to help you achieve the best design and even redesign to achieve cost-effective PCB from prototype to mass production produce.Our technicians have experience in providing recommendations for product and technology cost factors, and provide design solutions, structure, material selection, design rules, manufacturability, cost of different solutions, use of microvias, gold plating, special laminates And other quick feedback.
All our expertise is at your disposal.
BENEFITS OF WORKING WITH US
Our purchasing power of more than $9,000,000 provides you with:Purchasing leverage
Your order gets highest priority during production while offering the best possible terms
A wide PCB portfolio covering the full product life cycle
We can offer you： A lean process
Understanding your products and demands on your terms
High availability with commercial and technical competence and support
Our professional factory management team can provide you：Maximum
factory performance
Systematically sourced factories only used for technologies they are good at
Own staff in our factories providing proactive quality assurance and on-time deliveries
Nothing affects the PCB’s total cost and reliability as much as the initial design. This is why SHINELF is equipped with professional technicians to work directly with you to understand your requirements and those of the product.
Time- and cost-saving design support
Keeping Deliveries On Time
Semi-Automatic PET Bottle Blowing Machine Bottle Making Machine Bottle Moulding Machine PET Bottle Making Machine is suitable for producing PET plastic containers and bottles in all shapes.
At present, SHINELF all use intelligent production systems to monitor various production links in real time, which greatly improves production efficiency and shortens delivery time. SHINELF PCB single and double panel proofing can achieve the fastest 24-hour shipment, and the punctuality rate has always been 98% The above is 5 times faster than traditional factories, which greatly helps customers shorten the research and development cycle.
Your PCB Requirements = Our PCB Portfolio
The portfolio of PCBs we produce contains a broad variety of products; from 2L PCBs to highly advanced HDI and flex boards. Even though the PCBs we produce differ a lot regarding functionality and areas of use, they all have one thing in common. The common denominator for all PCBs is that our experts oversee that the production – from design to prototyping up to volume – is working according to our processes and product specification.
MULTILAYER
Multilayer PCBs
HDI
High Density Interconnect PCBs
RF
Radio Frequency PCBs
When you order PCBs from SHINELF, you are buying quality that pays for itself over time. This is guaranteed through a product specification and quality control that is far more stringent than other suppliers, and ensures that the product delivers what it promises. Furthermore, thanks to SHINELF’s considerable purchasing power, the factories are willing to adapt to our requirements.
Quality pays for itself in the long run even if not apparent at first sight
At first sight, PCBs differ little in appearance, irrespective of their inherent quality. It is under the surface that we focus on the differences so critical to the PCBs’ durability and functionality. Customers cannot always see the difference, but they can rest assured that SHINELF puts a great deal of effort into ensuring that in turn, their customers are also supplied with PCBs that meet the most stringent quality standards.
It is vital that PCBs function reliably both during the manufacturing assembly process and, out in the field. Apart from the costs involved, faults during assembly can end up being built into the final product via the PCBs, with possible failure in the field resulting in compensation claims. Relative to that, in our opinion, the cost of a premium quality PCB is negligible.
In all market sectors, particularly those producing products with critical applications, the consequences of such failures could be devastating.
Such aspects must be considered when comparing PCB prices. Reliability and a guaranteed long life cycle involve an initially higher outlay, but will pay for themselves in the long run.
Multilayer PCBs – Technical specification
Feature | SHINELF Multilayer PCBs Technical specification |
Number of layers | 4 – 22 layers standard, 30 layers advanced, 40 layers prototype. |
Technology highlights | Multiple layers of epoxy glass fiber bonded together with multiple layers of copper of varying thicknesses. |
Materials | High performance FR4, halogen-free FR4, low loss and low Dk materials |
Copper weights (finished) | 18μm – 210μm, advanced 1050μm / 30oz |
Minimum track and gap | 0.075mm / 0.075mm |
PCB thickness | 0.40mm – 7.0mm |
Maxmimum dimensions | 580mm x 1080mm, advanced 610mm x 1400mm |
Surface finishes available | HASL (SnPb), LF HASL (SnNiCu), OSP, ENIG, Immersion Tin, Immersion Silver, Electrolytic gold, Gold fingers |
Minimum mechanical drill | 0.20mm |
HDI PCBs – Technical specification
Feature | SHINELF HDI PCBs Technical specification |
Number of layers | 4 – 22 layers standard, 30 layers advanced |
Technology highlights | Multilayer boards with a higher connection pad density than standard boards, with finer lines/spaces, smaller via holes and capture pads allowing microvias to only penetrate select layers and also be placed in surface pads. |
HDI builds | 1+N+1, 2+N+2, 3+N+3,4+N+4, any layer in R&D |
Materials | FR4 standard, FR4 high performance, Halogen free FR4, Rogers |
Copper weights (finished) | 18μm – 70μm |
Minimum track and gap | 0.075mm / 0.075mm |
PCB thickness | 0.40mm – 3.20mm |
Maxmimum dimensions | 610mm x 450mm; dependant upon laser drilling machine |
Surface finishes available | OSP, ENIG, Immersion tin, Immersion silver, Electrolytic gold, Gold fingers |
Minimum mechanical drill | 0.15mm |
Minimum laser drill | 0.10mm standard, 0.075mm advanced |
Radio Frequency PCBs – Technical specification
Feature | SHINELF Radio Frequency PCBs Technical specification |
Number of layers | 2-20 layers |
Technology highlights | Controlled impedance, low loss materials, miniaturization |
Materials | Low loss / low Dk, higher performance FR-4, PPO, Teflon, hydrocarbon / ceramic filled |
Dielectric thickness | 0.1mm – 3.0mm |
Profile method | Routing, v-score |
Copper weights (finished) | ½ to 6 ounce |
Minimum track and gaps | 0.075mm / 0.075mm |
Metal core thickness | 0.4-2mm post bonded |
Maxmimum dimensions | 580mm x 1010mm |
Surface finishes available | HASL (Lead-free), OSP, ENIG, Immersion tin, Immersion silver |
Flexible PCBs (Flex)
Feature | SHINELF Flexible PCBs (Flex) |
Number of layers | 1 – 6L |
Technology highlights | Mainly polyimide materials, flex PCB’s are necessary when motion of the PCB is needed, when 3-D interconnections are necessary(i.e. replacing cables and connectors) or when these are both combined due to limited available space. |
Materials | Polyimide, Polyester |
Profile method | Laser cutting, punching, rout |
Copper weights (finished) | 18μm – 70μm |
Minimum track and gap | 0.075mm / 0.075mm |
PCB thickness | 0.05mm – 0.80mm |
Maxmimum dimensions | 450mm x 610mm |
Surface finishes available | OSP, ENIG, Immersion tin, Electrolytic gold, Gold fingers |
Minimum mechanical drill | 0.15mm |
Rigid-Flex PCBs – Technical specification
Feature | SHINELF Rigid-Flex PCBs – Technical specification |
Number of layers | 4-16 layers |
Technology highlights | Mixed materials including RF and high speed, standard FR-4, polyimide flex. Adhesiveless or adhesive based polyimide flexconstructions, with cover coat or flexible solder mask materials. |
Bending performance | Based on the specific design, the bend performance can range from a basic 90 °bend to fit to a full dynamic flex with 360° rangeof motion in the flex tail that will withstand continuous cycles throughout the product life. |
Bend features | Bend radius controls the flexibility of the flex portion of the board. The thinner the material the lower the bend radius and the more flexible the flex section |
Materials | RA copper, HTE copper, FR-4, polyimide, adhesive |
Copper weights (finished) | ½ ounce, 1 ounce, 2 ounce, 3 ounce |
Minimum track and gap | 0.075mm / 0.075mm |
PCB thickness | 0.4mm to 3mm |
PCB thickness in flex section | 0.05mm to 0.8mm |
Maxmimum dimensions | 457mm to 610mm |
Surface finishes available | ENIG, OSP Immersion tin, Immersion silver |
Minimum mechanical drill | 0.20mm |
Double sided PCBs
Item | Processing Capacity | Process Details |
Number of layers | 2 layers | |
Ink | Sun series | White oil: Sun 2000 series, green oil: Sun 07 series |
Plate type | FR-4 standard, FR-4 high performance, FR-4 halogen-free. | |
Dimensional accuracy | ±0.15mm | CNC shape tolerance ±0.15mm, V-cut board shape |
Thickness range | 0.2-2.4mm | Current plate thickness: 0.4/0.6/0.8/1.0/1.2/1.6/2.0/2.4 mm |
Thickness tolerance( t≥1.0mm) | ± 10% | Please pay attention to this point: due to the production process (sink copper, solder mask, pad spraying will increase the thickness of the board), generally go to the right tolerance |
Thickness tolerance ( t<1.0mm) | ±0.1mm | Please note this point: due to production process reasons (immersion copper, solder mask, pad spraying will increase the thickness of the board) generally go straight to the tolerance |
Minimum line width | 4mil（0.1mm） | At present, it can be connected to 4mil line width, and the line width should be greater than 4mil as much as possible |
Minimum clearance | 4mil（0.1mm） | At present, it can be connected with 4mil line spacing, and the gap should be greater than 4mil as much as possible |
Finished outer copper thickness | 35um/70um（1 OZ/2 OZ） | Refers to the thickness of the copper foil on the outer layer of the finished circuit board, 1 OZ=35um, 2 OZ=70um |
Finished inner copper thickness | 35um | All inner layers are made with 1 OZ |
Drilling hole diameter (machine drill) | 0.25--6.3mm | 0.25mm is the minimum hole diameter of the drilled hole, 6.3mm is the maximum hole diameter of the drilled hole. |
Via single-sided welding ring | ≥0.153mm（6mil） | If the conductive hole or plug-in hole unilateral welding ring is too small, but there is enough space there, the size of the unilateral welding ring is not limited; if there is not enough space and there are dense traces, the smallest unilateral Welding ring shall not be less than 0.153mm |
Finished hole diameter (machine drill) | 0.25--6.5mm | Due to the metal copper attached to the inner wall of the hole, the hole diameter of the finished hole is generally smaller than the hole diameter in the document |
Aperture tolerance (machine drill) | ±0.075mm | The tolerance of the drill hole is ±0.075mm, for example, the hole is designed as 0.6mm, and the finished hole diameter of the physical board is 0.525-0.675mm is qualified and allowed |
Finished hole diameter (machine drill) | 0.25--6.5mm | Due to the metal copper attached to the inner wall of the hole, the hole diameter of the finished hole is generally smaller than the hole diameter in the document |
Aperture tolerance (machine drill) | ±0.075mm | The tolerance of the drill hole is ±0.075mm, for example, the hole is designed as 0.6mm, and the finished hole diameter of the physical board is 0.525-0.675mm is qualified and allowed |
Solder mask type | Photosensitive ink | Photosensitive ink is the most used type now, thermosetting oil is generally used in low-grade single-sided cardboard |
Minimum character width | ≥0.15mm | The minimum width of the character, if less than 0.15mm, the physical board may cause unclear characters due to design reasons |
Minimum character height | ≥0.8mm | The minimum height of characters, if less than 0.8mm, the physical board may cause unclear characters due to design reasons |
Character aspect ratio | 1:5 | The most suitable aspect ratio is more conducive to production |
Route and outline spacing | ≥0.3mm (12mil) | For gong board shipment, the distance between the wiring of the line layer and the outline line of the board is not less than 0.3mm; for the shipment of V-cut board, the distance between the wiring and the center line of the V-cut should not be less than 0.4mm |
Imposition: gapless imposition gap | 0 gap fight | It is an imposition shipment, the gap between the middle board and the board is 0 (the document has detailed explanation) |
Imposition: There are gaps | 1.6mm | The gap of the gap imposition should not be less than 1.6mm, otherwise it will be more difficult when gong |
Pads manufacturers copper laying method | Hatch way to lay copper | The manufacturer is using reduced copper, please pay attention to this design with pads. |
Draw slot in Pads software | Use Drill Drawing layer | If there are many non-metallized slots on the board, please draw on the Drill Drawing layer |
Window layer in Protel/dxp software | Solder layer | A few engineers mistakenly put it in the paste layer, and do not deal with the paste layer |
Protel/dxp profile layer | Use Keepout layer or mechanical layer | Please note: Only one shape layer is allowed to exist in a file, and two shape layers are never allowed to exist at the same time.Please delete the unused shape layers, that is, you can only choose one of the Keepout layer or the mechanical layer when drawing the shape. |
Half hole process | Minimum half hole diameter 1.0mm.The number does not exceed 10 | The half-hole process is a special process, the minimum hole diameter should not be less than 1.0mm |
Solder mask | 0.1mm | If there is a solder mask requirement, it must be noted! The price of the solder mask will rise according to the process requirements. If the solder resist colors are green, red, and blue, the pad spacing must be ≥8mil; other color pad spacing must be ≥10mil |
Call Us
