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SIMCOM SIM8200G Multi Band 5G Module LTE HSPA+ module in LGA Type 5G module 5G NSA/SA

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Suzhou Story Network Technology Co., Ltd.Multispecialty supplier6 yrsCN

Key attributes

Industry-specific attributes

Chipset
X55

Application
IoT

Other attributes

Model Number
SIM8200G

Place of Origin
Jiangsu, China

Brand Name
SIMCOM

Form Factor
LGA

Dimensions(mm)
41.0*43.6*2.8mm

Temperature
-40℃ ~ +85℃

Packaging and delivery

Selling Units:
Single item

Single package size:
10X8X5 cm

Single gross weight:
0.200 kg

Lead time

Quantity (pieces)1 - 99 > 99
Lead time (days)5To be negotiated

Customization

Customized packaging
Min. order: 100

Know your supplier

Multispecialty supplier6 yrsLocated in CN
Registered trademarks (2)
Services
Quality control

Product descriptions from the supplier

1 - 19 pieces
$320.00
>= 20 pieces
$300.00

Quantity

Shipping

Shipping solutions for the selected quantity are currently unavailable
Item subtotal (0 variations 0 items)
$0.00
Shipping total
$0.00
Subtotal
$0.00

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