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SOI Wafer Silicon On Insulator Semiconductor Wafer

Key attributes

Other attributes

Place of Origin
Shanghai
Brand Name
Xinkehui
Model Number
silicon wafer
Type
SIO Wafer
Method
Fusion bonding
Diameter
2/3/4/6/8/12 inch
Device thickness
2-300 um
Tolerance
+/-0.5 um-2 um
Orientation
100/111/110 or others
Conductivity
P-type / N-type / Intrinsic
Resistivity
0.001-100000 ohm-cm
Dopant
Boron / Phosphorous / Antimony / Arsenic
Oxide thickness
500A-4 um
Handle wafer
Handle wafer

Packaging and delivery

Packaging Details
single wafer box
Port
shanghai

Supply Ability

Supply Ability
5000 Piece/Pieces per Year

Lead time

Quantity (pieces)1 - 10 > 10
Lead time (days)14To be negotiated

Customization

Customized logo
Min. order: 25
Customized packaging
Min. order: 25
Graphic customization
Min. order: 25

Product descriptions from the supplier

1 - 4 pieces
$10.00
>= 5 pieces
$2.00

Variations

Total options:

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