SOP ESOP ETSSOP HTSSOP QSOP SOT STAMPING LEAD FRAME SOT23-5L IC /semiconductor packaging stamping copper lead frame /Leadframe
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Key attributes
Other attributes
Place of Origin
China
Brand Name
Fillgold
Model Number
SOT23-6L
Type
Silicon Wafer
Product Name
SOT23-6L40*60)-8R
Material
A194/C19210/C194/C7025/C2680
Function
Semiconductor package
Size
Customized OEM
Thickness (MM)
Customized
Process
Stamping
Lead
12
Width
70mm
Surface Finish
Plating Sliver / Bare Copper/Roughing
Keyword
Lead frame
Packaging and delivery
Selling Units:
Single item
Single package size:
20X20X20 cm
Single gross weight:
0.100 kg
Lead time
| Quantity (pieces) | 1 - 200 | > 200 |
| Lead time (days) | 30 | To be negotiated |
Still deciding? Get samples first! Order sample
Samples
Maximum order quantity: 5 piece
Sample price:
$2.00/piece
Customization
Customized logo
Min. order: 1
Customized packaging
Min. order: 1
Graphic customization
Min. order: 1
For more customization details, message supplier
Product descriptions from the supplier
100 - 999 pieces
$6.00
>= 1000 pieces
$5.00
Quantity
Shipping
Item subtotal (0 variations 0 items)
$0.00
Shipping total
$0.00
Subtotal
$0.00
Still deciding? Get samples first! Order sample
Samples
Maximum order quantity: 5 piece
Sample price:
$2.00/piece
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