The AMTECH SMT solder Flux NC-559-ASM USED FOR North and south bridge, cards, cell phone chip, video chip BGA solder, bumping.
are specially formula for BGA reballing / balls works, they not only stick the balls much more well then regular flux, but also provide easy bonding with component pad to balls with typical oven profile. Also can use off the tin, the effect is very ideal
AMTECH SMT solder Flux
Suitable for mobile phone PCB, and SMD rework solder paste, such as PGA
low ionic activator system. It has fast soldering speed and low smoke generation. The surface insulation resistance of the residue after curing is very high.
100% inspection before shipments.
Zero mistake is our goal.
We always offer competitive prices and help our customers to cost down.
We keep a lot of stock for regular products. Usually, our lead time is only 3 days.