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Soldering Tin Planting Platform Repair Kit BGA Reballing Stencil For Mobile Phone CPU Dimensity MT6891Z U14
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Key attributes
Other attributes
Brand name
Amaoe
Application
Mobile phones
Material
S2 Alloy Tool Steel
Used for iphone
Support
Product Name
BGA Reballing Stencil For Mobile CPU Dimensity MT6891Z
keyword
For Mobile CPU Dimensity MT6891Z BGA Reballing Stencil
Application
Mobile CPU Dimensity MT6891Z Repair Reballing Stencil
Thickness
0.12mm
Package
Box
Shipment
Standard/Express
Quality
New
Delivery Time
3-7days
Packaging and delivery
Selling Units:
Single item
Single package size:
10X10X10 cm
Single gross weight:
0.300 kg
Lead time
| Quantity (sets) | 1 - 100 | > 100 |
| Lead time (days) | 3 | To be negotiated |
Still deciding? Get samples first! Order sample
Samples
Maximum order quantity: 1 set
Sample price:
$16.50/set
Customization
Have any needs please contact with us
Min. order: 100
For more customization details, message supplier
Product descriptions from the supplier
1 - 19 sets
$16.90
20 - 49 sets
$16.50
50 - 99 sets
$16.00
>= 100 sets
$15.00
Still deciding? Get samples first! Order sample
Samples
Maximum order quantity: 1 set
Sample price:
$16.50/set
Membership benefits
3-day coupon giveaway: up to US $80 offView more
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