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WDS580 Laptop Iphone mobile chip repairing machines bga rework equipment with reballing stencil kits

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Key attributes

Other attributes

Condition
New

Applicable Industries
Machinery Repair Shops

Video outgoing-inspection
Provided

Machinery Test Report
Provided

Marketing Type
Hot Product 2022

Warranty of core components
1 Year

Core Components
PLC

Showroom Location
None

Place of Origin
Guangdong, China

Warranty
3 years

Key Selling Points
Famous brand PLC

Weight (KG)
70 KG

Type
Soldering Station

Brand Name
wds bga rework station

Dimensions
L500*W590*H650mm

Usage
repair motherboard

Product name
WDS 580 BGA rework station

Function
Repair Motherboards

Power supply
AC 220V+-10% 50/60Hz

Total power
4800W

PCB size
Max. 470x370mm Min.10x10mm

Chip size
Max60*60mm Min 1*1mm

PCB thickness
0.3-5mm

Temperature interface
1pcs

Packaging and delivery

Packaging Details
wooden packing
WDS580 Laptop Iphone mobile chip repairing machines bga rework equipment with reballing stencil kits

Selling Units:
Single item

Single package size:
71X71X77 cm

Single gross weight:
70.000 kg

Lead time

Quantity (sets)1 - 1 > 1
Lead time (days)3To be negotiated

Customization

Customized logo
Min. order: 5
Customized packaging
Min. order: 5
Graphic customization
Min. order: 5

Product descriptions from the supplier

Minimum order quantity: 1 set
$1,680.00

Variations

Total options:

Shipping

Shipping solutions for the selected quantity are currently unavailable

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