ODM custom SIM card semiconductor packaging materials IC substrate

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Zhuhai Fillgold Technology Co., Ltd.4 yrs

CN

Key attributes

Other attributes

Place of Origin

China

Brand Name

FILLGOLD

Model Number

UO-21015A-A

Targrt products

PBGA,FBGA,FMC,SIP,MCP,FCCSP,POP,FCBGA,LGA,etc

Core material

MGC,Doosan,LG,Hitachi,Sumitomo,AMC

SR material

Taiyo,Hitachi,Sumitomo,SanEI

Pattern

Tenting,MSAP,PSAP,ETS,SAP

Soldermask

PSR series

Surface Finish

E'tro-Ni/Au ENIG,ENEPIG OSP(AFOP) Hard Au

Warranty

1 year

Size

Customized

MOQ

1 strip

Application

Smart phones, Networks, Customer electronics,Personal computers,etc

Packaging and delivery

Port

shenzhen

Selling Units:

Single item

Single package size:

20X20X20 cm

Single gross weight:

0.100 kg

Lead time

Quantity (pieces)	1 - 200	> 200
Lead time (days)	30	To be negotiated

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Samples

Maximum order quantity: 5 piece

Sample price:

$5.00/piece

Customization

Customized logo

Min. order: 1

Customized packaging

Min. order: 1

Graphic customization

Min. order: 1

For more customization details, message supplier

Know your supplier

Zhuhai Fillgold Technology Co., Ltd.

4 yrsLocated in CN

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Product descriptions from the supplier

20 - 199 pieces

$9.00

>= 200 pieces

$8.00

Variations

Total options:

Shipping

Shipping solutions for the selected quantity are currently unavailable

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Samples

Maximum order quantity: 5 piece

Sample price:

$5.00/piece

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