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QFN DFN QFP semiconductor packaging etching lead frame

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Key attributes

Other attributes

Place of Origin
Guangdong, China
Brand Name
Fillgold
Model Number
DFN 8 L 3X2
Type
Silicon Wafer
Product Name
DFN 8L 3X2
Type
DFN,QFN
Material
C7025
Function
Semiconductor package
Size
Customized OEM
Thickness (MM)
Customized
Process
progressive Stamping
Max Lead
64 PIN
Max Width
100mm
Surface Finish
ROUGH AG plating,PPF

Packaging and delivery

Selling Units:
Single item
Single package size:
20X20X20 cm
Single gross weight:
0.100 kg

Lead time

Product descriptions from the supplier

100 - 999 pieces
$4.00
>= 1000 pieces
$3.00

Quantity

Shipping

Item subtotal (0 variations 0 items)
$0.00
Shipping total
$0.00
Subtotal
$0.00

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