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Applying 4g High thermal conductivity heatsink thermal grease paste HY880 for PC DIY in blister card grey >5.15w/m-k

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Key attributes

Industry-specific attributes

CAS No.
7085-85-0

Other attributes

Place of Origin
Guangdong, China
Main Raw Material
Silicone
Usage
CPU, Graphics card, LED
Other Names
Silicone Sealant
MF
Mixture
EINECS No.
230-391-5
Brand Name
Halnziye
Model Number
HY880 4g
Type
Liquid Glue
Operating temperature
-30~280℃
Temperature resistance
-50~340℃
Thermal Rconductivity
>5.15W/m-k
Thermal Impedance
<0.004°C-in2/W
Gravity
>3.25 g/cm3
Thixotropic Index
280±10mm
Bleed
0.05%
Viscosity
12500
Silicone Compounds
10%
Carbon Compounds /Metal Oxide Compounds
45%

Packaging and delivery

Packaging Details
450pcs/box
size: 61*41*50cm
GW: 15kg

Lead time

Quantity (pieces)1 - 100101 - 1000 > 1000
Lead time (days)1015To be negotiated

Product descriptions from the supplier

100 - 999 pieces
$1.23
>= 1000 pieces
$1.18

Quantity

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$0.00
Shipping total
$0.00
Subtotal
$0.00

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