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PCB waterproof protection low pressure molding bostik PA hot melt adhesive
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LA MIEUX PRODUCTS, LTD.
4 yrs
Key attributes
Industry-specific attributes
CAS No.
63428-84-2
Other attributes
Place of Origin
France
Main Raw Material
Polyamide
Usage
LED, Automobile Industry, Micro Switch, Flat Cable, Connectors, Cables, Coil
Classification
Hot Melt Adhesives
Brand Name
BOSTIK
Model Number
THERMELT 195 Black
Type
Hot Melt Adhesives
Application
Low pressure molding
Raw Material
PA (Polyamide)
Features
Water Resistance
Color
Black
Certificate
ROHS, REACH, ISO9001
Shape
Granule and stick
Package
Woven bag with polyethylene bag
Waterproof Standard
IP65, IP67
Flame Resistance
V0, V2
Grade
Injection Molding Grade
Packaging and delivery
Packaging Details
Plastic bag inside, carton for outside packing
Selling Units:
Single item
Single package size:
28X18X3 cm
Single gross weight:
20.000 kg
Supply Ability
Supply Ability
100000 Kilogram/Kilograms per Year
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Lead time
Quantity (kilograms)
1 - 200
201 - 1000
> 1000
Lead time (days)
7
30
To be negotiated
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Samples
Maximum order quantity: 1 kilogram
Sample price:
$16.00/kilogram
Order sample
Minimum order quantity: 20 kilograms
$12.00 - $19.00
Quantity
-
+
Shipping
Shipping solutions for the selected quantity are currently unavailable
Item subtotal (0 variations 0 items)
$0.00
Shipping total
$0.00
Subtotal
$0.00
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Samples
Maximum order quantity: 1 kilogram
Sample price:
$16.00/kilogram
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