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WDS-700 BGA rework station PS3 PS4 Xbox 360 Mobile Laptop BGA VGA Chip Removal Machine For Motherboard Chip set Repair

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Key attributes

Other attributes

Condition
New
Machine Type
bga repair machine
Applicable Industries
Machinery Repair Shops, repair motherboard shop
Showroom Location
None
Video outgoing-inspection
Provided
Machinery Test Report
Provided
Marketing Type
New Product 2020
Warranty of core components
1 Year
Core Components
PLC
Place of Origin
Guangdong, China
Warranty
1 Year
Key Selling Points
Accurate temperature control
Weight (KG)
65
Brand Name
DTF
Voltage
220/110V
Current
AC
Rated Capacity
n
Rated Duty Cycle
n
Dimensions
L600 X W640 X H850mm
Use
remove ic bga chips
Temperature curve zones
3
Positioning
Infrared Laser
Product name
bga rework station
Heating Type
Infrared + Hot Air
business type
factory
Advantage
automatic
Function
remove ic chips
Application
MOTHERBOARD
After Warranty Service
Spare parts
After-sales Service Provided
Free spare parts

Packaging and delivery

Packaging Details
wooden box
Port
SHENZHEN PORT

Lead time

Quantity (pieces)1 - 1011 - 1000 > 1000
Lead time (days)310To be negotiated

Customization

Graphic customization
Min. order: 1
Customized packaging
Min. order: 1
Customized logo
Min. order: 1

Product descriptions from the supplier

1 - 9 pieces
$5,400.00
10 - 99 pieces
$5,100.00
100 - 9999 pieces
$4,500.00
>= 10000 pieces
$2,800.00

Variations

Total options:

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