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QianLi 3D CPU Black Stencil with Square holes design for Android BGA reballing and for MSM 32bit ARM
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Shenzhen Kaigexin Technology Co., Ltd.
5 yrs
CN
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Key attributes
Other attributes
Place of Origin
Guangdong, China
Brand Name
kaigexin
Product name
black Stencil for android cpus
Application
BGA reballing
Hole Design
Square
Feature
3D design chip secure
Cutting
Eco-Friendly laser cut
Weight
27g
Packaging and delivery
Packaging Details
Carton
Port
ShenZhen
Supply Ability
Supply Ability
10000 Piece/Pieces per Month
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Lead time
Quantity (pieces)
1 - 1000
> 1000
Lead time (days)
3
To be negotiated
Product descriptions from the supplier
>= 1 pieces
$4.12
Variations
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