Place of Origin
Guangdong, China
Copper Thickness
1OZ 2OZ 3OZ 4OZ
Surface Finishing
HASL LF ,Immersion gold ,OSP ,plated ,Flash gold
Assembly Type
FPC, FR4, Rigid-flex pcb, mcpcb
Min Assembly Specification
50mm*50mm
Max Assembly Specification
510mm*460mm
Components DIP
01005 Chip/0.35 Pitch BGA
Min device accuracy
+/- 0.04mm
Min footprint distance
0.3mm
Application
Telecommunication, Computer Application, Consumption Electronics