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Amaoe 4 in 1 Mid-Layer Motherboard CPU IC BGA Reballing Stencil Planting Positioning Tin Platform Repair Kit For Ipone 13 Pro/Max/Mini
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Key attributes
Other attributes
Brand name
AMAOE
Application
Mobile phones
Material
S2 Alloy Tool Steel
Used for iphone
Support
Product Name
BGA Reballing Stencil For Apple IP 13 Pro/Max/Mini
keyword
For iPhone 13 Pro/Max/Mini
Application
13 Pro/Max/Mini Repair Reballing Stencil
Thickness
0.12mm/0.1mm/0.08mm
Package
Box
Shipment
Standard/Express
Packaging and delivery
Selling Units:
Single item
Single package size:
10X10X10 cm
Single gross weight:
0.300 kg
Lead time
| Quantity (sets) | 1 - 100 | > 100 |
| Lead time (days) | 3 | To be negotiated |
Still deciding? Get samples first! Order sample
Samples
Maximum order quantity: 1 set
Sample price:
$21.00/set
Customization
Have any needs please contact with us
Min. order: 100
For more customization details, message supplier
Product descriptions from the supplier
1 - 9 sets
$22.00
10 - 19 sets
$21.50
20 - 49 sets
$20.50
>= 50 sets
$19.00
Still deciding? Get samples first! Order sample
Samples
Maximum order quantity: 1 set
Sample price:
$21.00/set
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