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4 in 1 Planting Positioning Mid-Layer Motherboard CPU IC BGA Reballing Stencil Platform Repair Kit For Ipone 12/Pro/Max/Mini

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Shenzhen Huimintong Parts Co., Ltd.Multispecialty supplier3 yrsCN

Key attributes

Other attributes

Brand name
AMAOE
Application
Mobile phones
Material
S2 Alloy Tool Steel
Used for iphone
Support
Product Name
BGA Reballing Stencil For Apple IP 12/Pro/Max/Mini
keyword
For iPhone 12/Pro/Max/Mini
Application
12/Pro/Max/Mini Repair Reballing Stencil
Thickness
0.12mm/0.1mm/0.08mm
Package
Box
Shipment
Standard/Express

Packaging and delivery

Selling Units:
Single item
Single package size:
10X10X10 cm
Single gross weight:
0.300 kg

Lead time

Quantity (sets)1 - 100 > 100
Lead time (days)5To be negotiated
Still deciding? Get samples first! Order sample

Samples

Maximum order quantity: 1 set
Sample price:
$18.50/set

Customization

Have any needs please contact with us
Min. order: 100

Product descriptions from the supplier

1 - 9 sets
$18.90
10 - 19 sets
$18.50
>= 20 sets
$17.50

Variations

Total options:

Shipping

Still deciding? Get samples first! Order sample

Samples

Maximum order quantity: 1 set
Sample price:
$18.50/set

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