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dsPIC33FJ64GS606-50I/MR (Embedded Processors, FPGA, Controller Chips, MCU IC) dspic33fj64gs606-50i/mr
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Shenzhen Delixin Technology Co., Ltd.
1 yr
CN
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Key attributes
Other attributes
Place of Origin
ORIGNAL
Brand Name
dsPIC33FJ64GS606-50I/MR
Model Number
dsPIC33FJ64GS606-50I/MR
Type
dsPIC33FJ64GS606-50I/MR
Series
dsPIC33FJ64GS606-50I/MR
Description
Electronic Components
Packaging Type
Winding tape/tray
Application
Electronic Components
Operating Temperature
CHIP Specification standard
Package / Case
Winding tape/tray
Features
CHIP Specification standard
Manufacturing Date Code
2023
Packaging and delivery
Selling Units:
Single item
Single package size:
25X10X25 cm
Single gross weight:
0.256 kg
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Lead time
Quantity (pieces)
1 - 1000
> 1000
Lead time (days)
2
To be negotiated
Customization
Customized logo
Min. order: 3000
Customized packaging
Min. order: 3000
For more customization details,
message supplier
Product descriptions from the supplier
10 - 99 pieces
$1.00
100 - 2999 pieces
$0.80
>= 3000 pieces
$0.50
Variations
Total options:
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