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dsPIC33FJ64GS606-50I/MR (Embedded Processors, FPGA, Controller Chips, MCU IC) dspic33fj64gs606-50i/mr

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Key attributes

Other attributes

Place of Origin
ORIGNAL
Brand Name
dsPIC33FJ64GS606-50I/MR
Model Number
dsPIC33FJ64GS606-50I/MR
Type
dsPIC33FJ64GS606-50I/MR
Series
dsPIC33FJ64GS606-50I/MR
Description
Electronic Components
Packaging Type
Winding tape/tray
Application
Electronic Components
Operating Temperature
CHIP Specification standard
Package / Case
Winding tape/tray
Features
CHIP Specification standard
Manufacturing Date Code
2023

Packaging and delivery

Selling Units:
Single item
Single package size:
25X10X25 cm
Single gross weight:
0.256 kg

Lead time

Quantity (pieces)1 - 1000 > 1000
Lead time (days)2To be negotiated

Customization

Customized logo
Min. order: 3000
Customized packaging
Min. order: 3000

Product descriptions from the supplier

10 - 99 pieces
$1.00
100 - 2999 pieces
$0.80
>= 3000 pieces
$0.50

Variations

Total options:

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