铜厚
9μm(1/4OZ)- 420μm(12OZ)
表面处理
HASL, HASL-LF, ENIG, Immersion Tin/Silver
Min.Machanical Drill Size
0.15mm(0.0059")
Impedance Control Tolerance
±8%
Min.BGA Pad Pitch
0.30mm(0.0118")
Min.SMT/QFP Pad Pitch
0.250mm(0.0100")
Solder Mask Registration
±0.025mm(±0.0010")
Min.Solder Mask Dam
0.076mm(0.0030")
Layer to Layer Registration
±0.038mm(±0.0015")
Min.Line Width
0.035mm(0.0014")
Line Width Control Tolerance
≤4milLine:±0.015mm (±0.0006")>4milLine:±10%
Min.Laser Via Size
0.075mm(0.0030")