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bga rework station hot air soldering station for mobile phone like xiaomi iphone 6s lg g3 motherboard all chip repair

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Key attributes

Other attributes

Machine Type
BGA Rework Station
Place of Origin
Guangdong, China
Warranty
1 Year
Brand Name
Dinghua
Voltage
AC220V/110V ±10%
Current
20A
Rated Capacity
5300W
Rated Duty Cycle
90%
Dimensions
L740*W630*H710MM
Use
Chip Level Repairing
After-sales Service Provided
Field installation, commissioning and training, Field maintenance and repair service, Video technical support
Product Name
mobile phone repairing machines
Automation Degree
Fully automatic
Heating
3 independent heaters
Applicable BGA chip
2*2mm-80*80mm
Applicable PCB size
Max 450*400 mm Min 22*22 mm
Product name
BGA rework station for motherboards
Application
Rework BGA, CCGA, QFN, CSP, LGA, SMD, LED etc
PCB Positioning
V-groove + universal fixture + movable PCB shelf
Temperature control
K-type thermocouple closed loop
Temperature accuracy
±2℃
Weight
64kg
Certification
CE, ISO

Packaging and delivery

Packaging Details
Strong wooden cases+wooden bars+proof foams with film
Port
Shenzhen

Supply Ability

Supply Ability
200 Set/Sets per Month

Lead time

Quantity (sets)1 - 23 - 3 > 3
Lead time (days)515To be negotiated

Product descriptions from the supplier

1 - 4 sets
$9,999.00
>= 5 sets
$7,999.00

Variations

Total options:

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