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good leveling Waterproofing Electronic Grade Epoxy Potting Compound for Printed Circuit Boards Electronic Encapsulation glue

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Key attributes

Industry-specific attributes

CAS No.
67763-03-05

Other attributes

Place of Origin
Guangdong, China
Main Raw Material
Epoxy
Usage
Construction
Other Names
epoxy resin and hardener
MF
mSiO2 nH2O
EINECS No.
231-545-4
Classification
Double Components Adhesives
Brand Name
Boqiao
Model Number
YH9300AB
Type
Two Component
Brand Name
Boqiao
Model Number
YH9300AB
Type
Two Component
Product name
Potting Glue For Electronic
Keywords
electronic potting glue
Viscosity
2000-3000
Advantage
Suitable High Temperate Climates
MOQ
1 KG
Material
Pure Epoxy
Packing
Bottle

Packaging and delivery

Selling Units:
Single item
Single package size:
40X27X35 cm
Single gross weight:
4.000 kg

Lead time

Quantity (kilograms)1 - 100101 - 10001001 - 5000 > 5000
Lead time (days)335To be negotiated
Still deciding? Get samples first! Order sample

Samples

Maximum order quantity: 1 kilogram
Sample price:
$4.00/kilogram

Customization

Customized logo
Min. order: 1000
Customized packaging
Min. order: 1000
Graphic customization
Min. order: 1000

Product descriptions from the supplier

1 - 99 kilograms
$4.50
100 - 999 kilograms
$4.00
>= 1000 kilograms
$3.60

Quantity

Shipping

Shipping solutions for the selected quantity are currently unavailable
Item subtotal (0 variations 0 items)
$0.00
Shipping total
$0.00
Subtotal
$0.00
Still deciding? Get samples first! Order sample

Samples

Maximum order quantity: 1 kilogram
Sample price:
$4.00/kilogram

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