Place of Origin
Shanghai, China
Product
Electronic component packaging
Processing Type
Plastic Injection Products
Material
PP/PP0/ABS/LCP/PPE/PS/ABS+PC
Standard
JEDEC/ EIAJ Standard
High Temperature Resistance
80°/120°/150°/270°
Suitable IC packaging type
QFN/BGA/QFP/SOP
Suitable IC packaging size
Customized
Certificates
ESD& RoHS environmental Tests
Surface treatment
10e4-10e8ohms