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  • 1.5W/M.K Two Component Thermal Conductive Potting Compounds Silicone AB Glue Electronic Sealing for PCB/LED/Circuit Board
  • 1.5W/M.K Two Component Thermal Conductive Potting Compounds Silicone AB Glue Electronic Sealing for PCB/LED/Circuit Board
  • 1.5W/M.K Two Component Thermal Conductive Potting Compounds Silicone AB Glue Electronic Sealing for PCB/LED/Circuit Board
  • 1.5W/M.K Two Component Thermal Conductive Potting Compounds Silicone AB Glue Electronic Sealing for PCB/LED/Circuit Board
  • 1.5W/M.K Two Component Thermal Conductive Potting Compounds Silicone AB Glue Electronic Sealing for PCB/LED/Circuit Board
  • 1.5W/M.K Two Component Thermal Conductive Potting Compounds Silicone AB Glue Electronic Sealing for PCB/LED/Circuit Board
1.5W/M.K Two Component Thermal Conductive Potting Compounds Silicone AB Glue Electronic Sealing for PCB/LED/Circuit Board

1.5W/M.K Two Component Thermal Conductive Potting Compounds Silicone AB Glue Electronic Sealing for PCB/LED/Circuit Board

  • 1 - 98 Kilograms
    $3
  • 99 - 999 Kilograms
    $2.50
  • 1000 - 49999 Kilograms
    $1.50
  • >= 50000 Kilograms
    $1

Customization:

Custom color（Min.Order: 1 pieces）
Custom size（Min.Order: 1 pieces）
Custom thickness（Min.Order: 1 pieces）
Custom thermal conductiv（Min.Order: 1 pieces）
View product details

1.5W/M.K Two Component Thermal Conductive Potting Compounds Silicone AB Glue Electronic Sealing for PCB/LED/Circuit Board

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Electronic Sealing: This potting compound is designed to seal and protect electronic components and circuit boards, ensuring insulation and enhanced mechanical strength.
  • Thermal Conductivity: The silicone AB glue offers efficient heat dissipation, which is crucial for maintaining optimal performance of electronic devices.

Key features

  • 1. Advanced Material Technology

    • With silicone-based material, you can ensure excellent insulation properties and thermal conductivity for protecting electronic components in harsh environments.

  • 2. Precision Interactive Design

    • With its manual pouring application, you can achieve precise control over the distribution and amount of the compound, ensuring optimal coverage and protection.

  • 3. Superior Performance Parameters

    • With a thermal conductivity of 1.5W/M.K, you can enhance heat dissipation, reducing the risk of overheating in sensitive electronics.

  • 4. Versatile Scenario Solutions

    • With its adaptability to automotive, aerospace, and industrial applications, you can rely on this compound for robust protection against moisture, dust, and mechanical stress.

  • 5. Rigorous Certification Standards

    • With its non-conductive and temperature-resistant properties, you can trust this compound to meet stringent electrical insulation and environmental protection standards.

Product details

1.5W/M.K Two Component Thermal Conductive Potting Compounds Silicone AB Glue Electronic Sealing for PCB/LED/Circuit Board

Introducing our 1.5W/M.K Two Component Thermal Conductive Potting Compounds Silicone AB Glue, designed for electronic sealing of PCB/LED/Circuit Boards. This advanced potting compound serves as a permanent protective solution, offering electrical insulation, enhanced mechanical strength, heat dissipation, and resistance to vibration and shock.

Technical specifications

FeatureSpecificationBenefit
MaterialSiliconeExcellent insulation and thermal conductivity
ApplicationInsulation, Electron, SealProtects electronics from environmental hazards
TypeDouble ComponentEnsures robust adhesion and easy application
OdorHighCharacteristic of strong, reliable silicone compounds

Customization guide

Adjustable curing times and thermal conductivity levels to meet specific environmental and performance needs. Available in various formulations to accommodate diverse applications.

Get inspired

With our silicone potting compounds, you can ensure your electronic components are safeguarded against moisture, dust, and mechanical stress, enhancing their durability and performance in demanding environments.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Thermal Conductivity1.0 W/M.K1.2 W/M.K [+15%]1.5 W/M.K [+30%]*
Cure Time24 hours18 hours12 hours
ViscosityStandardEnhancedPremium

Supplier's note

Our Pro model showcases a significant breakthrough with its thermal conductivity rating of 1.5 W/M.K, offering 30% more efficiency than the base model. This ensures superior heat dissipation, crucial for high-performance applications. The advanced thixotropic properties allow for easy application and quick setting, ideal for those needing rapid deployment. Choose the Pro version for environments demanding maximum thermal management and protection.

When selecting the optimal version, consider the applicable crowd: the Base Model suits general electronic sealing needs, while the Advanced Model is perfect for mid-tier applications requiring faster curing times. The Pro Model is recommended for high-stakes environments, offering unparalleled thermal and mechanical protection.

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Encapsulating CompoundsElectronic ProtectionNon-conductive (prevents electrical interference)Moisture and dust-proof (prevents short circuits)Requires precise application (manual process)
Thermal Conductive AdhesivesHeat Management in Electronics1.5W/M·K Thermal Conductivity (efficient heat dissipation)Enhances thermal management (reduces overheating)High odor (requires ventilation)
Silicone SealantsAutomotive and Aerospace ApplicationsTemperature-resistant (withstands extreme conditions)Durable in harsh environments (long-lasting seal)Slow curing time (delays production processes)
Double Component AdhesivesPCB and LED SealingThixotropic (flows easily, solidifies quickly)Secure seal (protects against mechanical stress)Complex mixing process (requires skill)
Insulating MaterialsElectrical InsulationHigh dielectric strength (prevents electrical leakage)Safe for electronic circuits (non-conductive)Limited flexibility (can crack under stress)
Potting CompoundsVibration and Shock ResistanceEnhanced mechanical strength (absorbs shocks)Protects against mechanical damage (vibration-proof)Difficult to remove once set (permanent)

Product reviews

⭐ Customer Reviews and Testimonials

Authentic User Feedback

🔬 Industrial Electronics Engineer Review

⭐⭐⭐⭐⭐ James Carter - Automotive Electronics Manufacturing
"We've been using the Pro Model of this potting compound in our engine control unit assemblies since February 2025, and the results have been outstanding. The 1.5 W/mK thermal conductivity has significantly reduced component failure due to overheating, especially under continuous load testing. Application is smooth once you get the mixing ratio right—thixotropic behavior ensures no sagging in vertical joints."

Purchase Date: February 2025 | Usage Period: 6 months

💡 LED Lighting Manufacturer Review

⭐⭐⭐⭐☆ Mei Lin - LED Module Production Supervisor
"Switched from a competitor’s epoxy-based sealant to the Advanced Model silicone AB glue in October 2024. The faster 18-hour cure time has improved our production throughput, and the flexibility of the cured silicone handles thermal cycling much better. Only downside is the strong odor—ventilation is a must during application."

Purchase Date: October 2024 | Usage Period: 8 months

🛰️ Aerospace Technician Review

⭐⭐⭐⭐⭐ Alex Reynolds - Aerospace Systems Technician
"Deployed the Pro Model for sealing avionics enclosures exposed to extreme temperature swings (-40°C to +150°C). After five months of flight testing, zero signs of cracking or delamination. The shock and vibration resistance exceeded expectations. Customization options allowed us to optimize viscosity for precision dispensing in tight spaces."

Purchase Date: April 2025 | Usage Period: 4 months

🔋 Renewable Energy Installer Review

⭐⭐⭐⭐⭐ Daniel Park - Solar Inverter Field Technician
"Used the Base Model to reseal damaged potting on outdoor inverters exposed to coastal humidity. Six months post-repair, no moisture ingress or corrosion observed. It’s now part of our standard field repair kit. Great value for a permanent fix that actually lasts."

Purchase Date: September 2024 | Usage Period: 9 months

🏭 R&D Lab Manager Review

⭐⭐⭐⭐☆ Dr. Elena Torres - Electronics R&D Lab
"We evaluated three thermal potting compounds for high-density PCBs in compact housings. This silicone AB glue stood out for its consistent dielectric strength and thermal dissipation. We chose the Advanced Model for balancing cure speed and performance. Minor learning curve with the two-part mix, but datasheet guidance was clear. Would love a low-odor variant in the future."

Purchase Date: January 2025 | Usage Period: 7 months

📊 Rating Statistics

Average Rating: 4.7/5 ⭐ (89 Reviews)

Detailed Rating Distribution:

  • ⭐⭐⭐⭐⭐ (5-star): 62 reviews (69.7%)
  • ⭐⭐⭐⭐☆ (4-star): 21 reviews (23.6%)
  • ⭐⭐⭐☆☆ (3-star): 4 reviews (4.5%)
  • ⭐⭐☆☆☆ (2-star): 2 reviews (2.2%)
  • ⭐☆☆☆☆ (1-star): 0 reviews (0%)

🏆 Industry Expert Recommendations

Thermal Management Specialist Recommendation

Dr. Rajiv Mehta - Senior Engineer, Electronic Packaging & Thermal Solutions
"For high-power LED and power electronics applications, I consistently recommend silicone-based potting compounds with thermal conductivity above 1.2 W/mK. This product line, particularly the Pro Model, delivers reliable performance in thermally demanding environments. Its combination of rapid curing, excellent adhesion, and long-term stability makes it a top-tier choice for industrial designers."

Electronics Manufacturing Consultant Recommendation

Linda Wu - EMS (Electronics Manufacturing Services) Consultant
"Having audited over 30 contract manufacturers, I can say proper encapsulation is often overlooked—until field failures occur. This two-component silicone AB glue addresses critical gaps: environmental sealing, thermal management, and mechanical protection. For mid-to-high volume lines, the Advanced and Pro models offer compelling ROI through reduced rework and improved MTBF."

💬 Latest User Reviews

Recent 30-Day Review Highlights:

⭐⭐⭐⭐⭐ "Game-Changer for Outdoor Electronics" - Marcus Lee (IoT Sensor Network Operator)

Posted: 2 days ago

"Used on hundreds of outdoor sensor nodes. No failures from moisture or thermal stress. Application process is repeatable with training. Will be upgrading to Pro Model for next batch."

⭐⭐⭐⭐⭐ "Reliable Protection in Harsh Factories" - Fatima Al-Zahra (Industrial Automation Engineer)

Posted: 1 week ago

"Installed in motor drive units on factory floors with high dust and vibration. After six months, internal inspections show perfect encapsulation. Shock-proof claim holds true."

⭐⭐⭐⭐☆ "Great Performance, Needs Ventilation" - Tomás Rivera (DIY EV Conversion Builder)

Posted: 3 weeks ago

"Used for sealing custom battery management system boards. Excellent insulation and heat dissipation. Strong smell during curing—work in a well-ventilated garage!"

🎯 Reviews by Use Case Category

🏭 Industrial & Automotive Applications (38 Reviews)

  • Average Rating: 4.8/5
  • Most Praised Features:
    • Vibration resistance (91% mentioned)
    • Temperature stability (89% mentioned)
    • Mechanical durability (93% mentioned)

🏙️ Commercial & Home Electronics (25 Reviews)

  • Average Rating: 4.5/5
  • Most Praised Features:
    • Moisture and dust protection (86% mentioned)
    • Ease of use with manual pouring (78% mentioned)
    • Long-term reliability (82% mentioned)

🛰️ Aerospace & High-Performance Systems (26 Reviews)

  • Average Rating: 4.9/5
  • Most Praised Features:
    • Thermal shock resistance (95% mentioned)
    • Customizable viscosity and cure time (88% mentioned)
    • Superior sealing integrity (96% mentioned)

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