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The 12pcs BGA Reball Reballing Stencil Template is an essential tool for precision soldering and reballing operations, specifically designed for DDR memory modules. Made from high-quality stainless steel, these stencils ensure durability and accuracy in demanding industrial environments.
| Feature | Specification | Benefit |
|---|---|---|
| Material | Stainless Steel | Ensures precision and durability |
| Design | Custom Patterns | Accurate solder placement for DDR modules |
| Precision | 0.45MM | High precision for reliable component placement |
| Versatility | DDR1-DDR5 | Suitable for a wide range of memory modules |
With adjustable stencil designs, you can tailor the templates to meet specific DDR memory alignment needs, ensuring precise soldering for diverse electronic components.
Unlock the potential of your electronics manufacturing with our versatile and durable BGA reballing stencils. Perfect for technicians seeking precision and efficiency in their soldering tasks.
| Parameter | Base Model | Advanced Model | Pro Model |
|---|---|---|---|
| Material Quality | Stainless Steel | Enhanced Alloy | Premium Alloy |
| Precision | 0.45MM | 0.40MM | 0.35MM* |
| Versatility | DDR1-DDR3 | DDR1-DDR4 | DDR1-DDR5 |
Our Pro version's precision, marked at 0.35MM, surpasses industry standards, enabling meticulous soldering of sensitive components. When combined with its premium alloy construction, this ensures long-lasting durability and performance in high-demand settings. Choose the Pro model if you require the highest precision and versatility for complex electronics assembly, ensuring seamless integration across various DDR memory modules.
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