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  • 1331 DIP8 new OriginalBOM Inventory Supporting Service 1331 Chip ic
  • 1331 DIP8 new OriginalBOM Inventory Supporting Service 1331 Chip ic
  • 1331 DIP8 new OriginalBOM Inventory Supporting Service 1331 Chip ic
  • 1331 DIP8 new OriginalBOM Inventory Supporting Service 1331 Chip ic
  • 1331 DIP8 new OriginalBOM Inventory Supporting Service 1331 Chip ic
  • 1331 DIP8 new OriginalBOM Inventory Supporting Service 1331 Chip ic
1331 DIP8 new OriginalBOM Inventory Supporting Service 1331 Chip ic

1331 DIP8 new OriginalBOM Inventory Supporting Service 1331 Chip ic

$0.22-$1.10/ Piece|10 Piece/Pieces(Min. Order)
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1331 DIP8 new OriginalBOM Inventory Supporting Service 1331 Chip ic

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Integrated Circuit Functionality: Designed for standard applications such as signal processing, power management, and control functions in electronic devices.
  • DIP8 Compatibility: Features a Dual In-Line Package (DIP) with 8 pins, enabling seamless integration into standard PCBs for easy handling and circuit design.

Key features

  • 1. Durable Material Construction

    • With a corrosion-resistant plastic body and metal pins, ensure reliable performance in diverse electronic environments. The metal pins enhance conductivity and durability compared to all-plastic alternatives*.

  • 2. User-Friendly DIP8 Package Design

    • With a standard DIP8 package, enable effortless integration into PCBs and compatibility with existing hardware setups, reducing assembly complexity versus non-standard ICs*.

  • 3. Energy-Efficient Performance

    • With low-power and low-voltage operation, achieve up to 20% lower energy consumption than traditional ICs in similar applications*, ideal for battery-powered devices.

  • 4. Versatile Scenario Adaptability

    • Designed for standard electronic systems, support applications like microcontrollers and power management in both portable and embedded systems, offering broader usability than niche ICs*.

  • 5. Compliance with Industry Standards

    • Meet standard certification requirements for integrated circuits, ensuring compatibility and reliability in mainstream electronic manufacturing workflows.

Product details

1331 DIP8 new OriginalBOM Inventory Supporting Service 1331 Chip ic

The 1331 DIP8 IC is a compact, low-power integrated circuit designed for standard electronic applications. Housed in a DIP-8 package with 8 metal pins, this chip offers reliable performance in microcontroller units (MCUs), power management systems, and signal processing circuits. Its plastic-and-metal construction ensures durability, while its small form factor enables seamless integration into space-constrained designs.

Technical specifications

FeatureSpecificationApplication Scenario
Package TypeDIP-8 (Dual In-line Package)Easy PCB integration in embedded systems
MaterialPlastic body with tin/gold pinsEnhanced conductivity and corrosion resistance
Pin Configuration8 pins (4 rows × 2 columns)Standard connections for prototyping
Power ConsumptionLow-power design (≤ 50mW)Battery-operated devices and IoT sensors
Operating Voltage2.7V to 5.5VVersatile compatibility with MCU boards

Customization guide

Adjustable parameters include voltage thresholds and timing settings to meet specific requirements for low-power modes or signal processing precision.

Get inspired

With its low-power efficiency and compact DIP-8 design, the 1331 IC is ideal for wearable electronics, smart home sensors, and industrial control systems. Its compatibility with standard PCBs simplifies prototyping and mass production.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Power Efficiency85%+15% (98.5%)+30% (100%*)
Operating Temp Range-20°C to +70°C-40°C to +85°C-55°C to +125°C
Programming FlexibilityBasic firmwareCustomizable profilesFull API access

Supplier's note

  1. Technical Breakthroughs:

    • The Pro Model’s operating temperature range (-55°C to +125°C) exceeds industry standards by 40%, enabling use in extreme environments like automotive systems.
    • The Advanced Model’s 98.5% power efficiency reduces energy waste by 12% compared to legacy ICs.
    • The Base Model’s compatibility with 2.7V to 5.5V ensures seamless integration into low-cost IoT devices.

  2. Optimal Version Selection:

    • Base Model: Ideal for hobbyists and basic IoT projects requiring minimal power and standard temperature ranges.
    • Advanced Model: Suited for industrial sensors and medical devices needing robust temperature tolerance and moderate customization.
    • Pro Model: Recommended for aerospace and automotive applications where extreme reliability and full programmability are critical.

*Pro Model efficiency optimized via advanced CMOS architecture.

Frequently asked questions

  • Which DIP8 IC model is best for low-power battery-operated devices?

  • How should the 1331 DIP8 IC be stored to prevent oxidation and damage?

  • Why is the plastic and metal packaging of the 1331 DIP8 IC better than other IC packages?

  • Can the 1331 DIP8 IC be programmed for custom embedded systems?

  • Is the 1331 DIP8 IC RoHS-compliant and certified for industrial use?

  • What applications use the 1331 DIP8 IC besides microcontroller units?

  • How do I safely solder the 1331 DIP8 IC onto a PCB without damaging it?

  • Does the 1331 DIP8 IC support low-voltage operations for IoT devices?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Microcontroller ICsEmbedded systems, IoT devicesOperating Voltage: 1.8V–5.5V (Industry: 3.3V–5V) ▲
Frequency: 24MHz (Industry: 16MHz) ▲		Lower power consumption (1.8V ▲)
Higher processing speed (24MHz ▲)		Requires specialized programming tools (Advanced version only)
Power Management ICsBattery-operated devices, portable gearEfficiency: 95% (Industry: 85%) ▲
Output Voltage Stability: ±1% (IEC 60068-2-38)		Extended battery life ▲
Stable performance in fluctuating conditions		Higher cost for high-efficiency models (Advanced tier)
Signal Processing ICsAudio/video systems, sensor interfacesSignal-to-Noise Ratio: 90dB (Industry: 75dB) ▲
Latency: <1ms (ISO/IEC 14496)		Superior audio/video clarity ▲
Real-time data processing capability		Limited compatibility with legacy systems (Base version)
General Purpose ICsConsumer electronics, basic circuitsPin Count: 8 (DIP8)
Operating Temp: -40°C to +85°C (MIL-STD-810)		Cost-effective ▲
Wide temperature tolerance for rugged environments		Lower performance compared to specialized ICs
Low-Power ICsWearables, smart sensorsQuiescent Current: 0.5µA (Industry: 5µA) ▲
Wake-Up Time: 10µs (JEDEC JESD22)		Prolongs battery life by 3x ▲
Ultra-fast response for sensor triggers		Limited processing power for complex tasks
Programmable Logic ICsCustom circuits, FPGA applicationsLogic Cells: 1000 (Industry: 500) ▲
Reprogrammability: 10,000 cycles (ASTM F1927)		High flexibility for custom designs ▲
Long lifecycle with reprogrammability		Steeper learning curve for non-specialists

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The comparison data is based on manufacturer information and industry standards. Actual results may vary depending on individual use cases. It is advisable to verify details with the supplier for the most accurate information.