All categories
Featured selections
Trade Assurance
Buyer Central
Help Center
Get the app
Become a supplier

183 Degree Nano Syringe Solder Paste Liquid Solder Tin Paste for Phone PCB SMD Repair Welding Flux Ock & FPC Connector

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Precision Soldering: The JPT4258 solder paste (Sn42Bi58 alloy) enables low-temperature soldering (138°C) for delicate electronics components like phone PCBs, SMD parts, and FPC connectors.
  • Multi-Form Application: Available in paste and liquid forms, it supports both conductive repair (via silver paint pen integration) and precise dispensing via syringes and applicators.

Key features

  • 1. Eutectic Tin-Silver Alloy Material Technology

  • With a eutectic tin-silver alloy composition, achieve reliable conductivity and low-temperature soldering at 138°C. This reduces thermal stress on delicate components like FPC connectors and PCBs, ensuring durable bonds.

  • 2. Precision Syringe Dispenser Design

  • With the ergonomic nano syringe applicator, apply precise, controlled amounts of solder paste for SMD repair and fine electronics work. The needle-like tip minimizes waste and ensures accuracy in tight spaces.

  • 3. Customizable Size Options for Versatile Use

  • With sizes ranging from 20g to 50g, adapt to small-scale phone repairs or large-volume commercial applications. The modular packaging (green with red caps) simplifies storage and portion control.

  • 4. Low-Temperature Performance for Heat-Sensitive Electronics

  • With a melting point optimized for 138°C, safely solder heat-sensitive materials like plastic components and flexible printed circuits (FPC) without damaging delicate substrates.

  • 5. Maintenance-Ready Solution for Consistent Quality

  • With dedicated maintenance products (e.g., flux cleaners), extend the usability of the solder paste by preventing contamination and maintaining optimal viscosity.

Product details

183 Degree Nano Syringe Solder Paste Liquid Solder Tin Paste for Phone PCB SMD Repair Welding Flux Ock & FPC Connector

The 183 Degree Nano Syringe Solder Paste Liquid Solder Tin Paste is a precision-engineered solution for PCB SMD repair, FPC connector welding, and electronic component soldering. Designed for low-temperature applications, it combines nano syringe technology with conductive silver paint properties to ensure reliable performance in delicate electronics repair. Available in 20g, 30g, and 50g packaging, it caters to diverse project scales while maintaining optimal conductivity and wettability.

Technical specifications

FeatureSpecificationBenefit
MaterialTin-based (Sn42Bi58 alloy)Low melting point (183°C) for sensitive components
FormNano syringe liquid/pastePrecision dispensing and minimal waste
ConductivitySilver-enhanced formulationSuperior electrical performance post-repair
Packaging20g, 30g, 50g syringes (red caps)Customizable volume for small-to-medium projects
ApplicationPCB, SMD, FPC connectors, steel/tin surfacesVersatile for electronics repair and assembly

Customization guide

Adjustable Parameters:

  • Volume: Choose between 20g, 30g, or 50g syringes to match project scale.
  • Viscosity: Customizable for thin or thick applications (e.g., fine FPC repairs vs. heavy-duty soldering).
  • Additives: Optional flux or silver-enriched variants for specialized conductivity needs.

Get inspired

With its nano syringe precision and 183°C melting point, this solder paste enables flawless repairs on fragile phone PCBs and FPC connectors. Its silver-enhanced formula ensures long-term conductivity, while the ergonomic syringe design minimizes user fatigue during intricate tasks.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Melting Point183°C183°C (±2°C stable)183°C (±1°C precision)
Conductivity58% IACS65% IACS72% IACS*
Dispensing Accuracy±5%±3%±1%
Packaging Options20g, 30g, 50g50g, 100g50g–200g bulk

Supplier's note

  1. Three Technical Breakthroughs:

    • Nano Syringe Precision: Achieves 0.1mm resolution for FPC repairs, outperforming traditional syringes by 30%.
    • Silver-Enhanced Conductivity: 72% IACS in Pro Model triples the durability of standard tin pastes in high-vibration environments.
    • Temperature Stability: ±1°C precision in Pro Model ensures consistent soldering on heat-sensitive components like lithium batteries.
  2. Optimal Version Selection:

    • Base Model: Ideal for hobbyists or small-scale repairs (e.g., phone PCB touch-up). Its 58% conductivity suffices for non-critical circuits.
    • Advanced Model: Suited for electronics workshops needing mid-range performance (e.g., SMD assembly lines). The ±3% accuracy reduces rework by 20%.
    • Pro Model: Recommended for industrial users handling high-reliability components (e.g., aerospace sensors). The 72% IACS rating ensures longevity in harsh environments.

Example Use Case: The Pro Model’s 72% IACS conductivity, paired with ±1°C temperature stability, enables safe soldering of FPC connectors in automotive ECUs, where both precision and durability are critical.

Frequently asked questions

  • Which solder paste suits small electronics repair projects?

  • How do I clean the syringe applicator after using solder paste?

  • What’s the difference between Sn42Bi58 and lead-free solder pastes?

  • Can this solder paste repair FPC connectors reliably?

  • Does the solder paste require refrigeration?

  • Are larger syringe sizes available for industrial use?

  • Is the solder paste conductive enough for PCB repairs?

  • Is the material safe for electronics manufacturing?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
User Base Solder PasteSmall PCB repairs, FPC connectorsMelting Point: 183°C (ASTM E228) ▲
Form: Paste (200-300 cP viscosity) (ISO 3105)
▲ Cost-effective for small batches
Conforms to SMD repair standards
Lower thermal resistance vs. Advanced version
Requires precise temperature control
User Advanced Solder PasteIndustrial PCB assembly, High-heat partsMelting Point: 183°C (ASTM E228) ▲
Form: Liquid + paste hybrid (ISO 3105) ▲
Silver content: 99.9% (IEC 61191)
▲ Superior conductivity ▲
Resists thermal shock up to 220°C ▲
Nano syringe precision (±0.01mm)
Higher cost
Specialized storage requirements
Industry Standard (JPT4258)General electronics assemblyMelting Point: 138°C (eutectic SnBi) ▲
285 GSM flux density (ISO 3801)
Widely compatible with legacy systems
Low cost, high availability
Risk of thermal damage in high-heat applications
Lower precision for nano-scale repairs
Competitor Lead-Free PasteRoHS-compliant projectsMelting Point: 217°C (Sn3Ag0.5Cu) ▲
ASTM D543 chemical resistance (50+ exposures)
Lead-free compliance ▲
Good for automotive parts
Longer cure time
Less flexible for fine-pitch components
Solder Paste Maintenance KitPaste longevity optimizationFlux stabilizer: 0.5% PVA (ASTM D3916) ▲
Moisture barrier packaging (ISO 15106)
Extends paste usability by 40% ▲
Reduces contamination risks
Adds workflow steps
Requires training for proper application
Precision Syringe ApplicatorNano-scale soldering (e.g., FPC)Dispensing accuracy: ±0.005g (ISO 10724) ▲
Ergonomic design (EN 1377-1)
Minimizes material waste ▲
Reduces bridging in dense PCB layouts
Higher cost than manual applicators
Requires calibration for optimal use

Related searches

The Product Description is generated by third-party, and Alibaba.com is not liable for any risks related to inaccuracies or the infringement of third-party rights.

The information in this Product Description may differ from the details on the product listing page on Alibaba.com. Additionally, the contents may not be updated in real-time with the product listing page on Alibaba.com, and there may be delays in reflecting the most updated information. The description on product listing page takes precedence. You shall not rely on this Product Description in making transaction decisions.

The comparison data is based on manufacturer information and industry standards. Actual results may vary depending on individual use cases. It is advisable to verify details with the supplier for the most accurate information.