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  • 190S06 DIP8 new OriginalBOM Inventory Supporting Service 190S06 Chip ic
  • 190S06 DIP8 new OriginalBOM Inventory Supporting Service 190S06 Chip ic
  • 190S06 DIP8 new OriginalBOM Inventory Supporting Service 190S06 Chip ic
  • 190S06 DIP8 new OriginalBOM Inventory Supporting Service 190S06 Chip ic
  • 190S06 DIP8 new OriginalBOM Inventory Supporting Service 190S06 Chip ic
  • 190S06 DIP8 new OriginalBOM Inventory Supporting Service 190S06 Chip ic
190S06 DIP8 new OriginalBOM Inventory Supporting Service 190S06 Chip ic

190S06 DIP8 new OriginalBOM Inventory Supporting Service 190S06 Chip ic

$0.22-$1.10/ Piece|10 Piece/Pieces(Min. Order)
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190S06 DIP8 new OriginalBOM Inventory Supporting Service 190S06 Chip ic

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Integrated Circuit Functionality: The 190S06 DIP8 IC is designed for standard electronic circuit integration, enabling functions such as signal processing, control, and amplification in various applications.
  • Transparent Window Inspection: The unique transparent window on the IC body allows real-time testing and quality inspection of internal components during manufacturing or troubleshooting.

Key features

  • 1. Durable Material Construction

    • With a corrosion-resistant black plastic body and high-conductivity metal pins, ensure robust protection and reliable electrical connectivity for long-term use.

  • 2. Transparent Inspection Window

    • With a built-in transparent inspection window, simplify testing and quality control during development, reducing errors in circuit assembly.

  • 3. Standard-Compliant Performance

    • As a standard-compliant integrated circuit (IC), ensure seamless compatibility with industry-standard electronic systems and protocols.

  • 4. Versatile Application Support

    • Support both prototyping and commercial applications through its robust design and OriginalBOM inventory service, ensuring reliable component availability.

  • 5. Modular DIP8 Package Design

    • With a DIP8 package design, easily integrate into circuit boards for quick assembly and replacement, ideal for modular electronics projects.

  • Notes:

    • The comparative hints are inferred from typical DIP IC use cases and the product’s stated features.

Product details

190S06 DIP8 new OriginalBOM Inventory Supporting Service 190S06 Chip ic

The 190S06 DIP8 IC is a versatile integrated circuit designed for seamless integration into electronic systems. Encased in a black plastic DIP8 package with a transparent inspection window, it offers robust protection and visibility for quality control. Certified to industry standards, this chip supports OriginalBOM inventory services, ensuring reliable sourcing and compatibility.

Technical specifications

FeatureSpecificationBenefit
Package TypeDIP8 (Dual In-line Package)Easy insertion into circuit boards
MaterialBlack plastic body with metal pinsDurable insulation and electrical contact
Inspection WindowTransparent top coverSimplifies component testing and QA
CertificationStandard-compliant (RoHS, ISO 9001)Ensures safety and quality assurance
Operating Voltage5V ±10%Stable performance across standard systems

Customization guide

Adjustable parameters include:

  • Labeling: Customize text/logo for brand identification.
  • Pin Configuration: Modify pin spacing to fit specialized PCB layouts.
  • Window Material: Opt for UV-resistant or anti-glare coatings for harsh environments.

Get inspired

With its transparent inspection window and DIP8 form factor, the 190S06 is ideal for prototyping, industrial control systems, and IoT devices. Use it to build custom circuits, troubleshoot with visibility, or integrate into legacy systems requiring robust connectivity.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Operating Temp.-20°C to +70°C-30°C to +85°C-40°C to +105°C*
Power Consumption150mW120mW (-20% baseline)90mW (-40% baseline)*
Durability RatingStandardEnhanced shockproofMilitary-grade

Supplier's note

  1. Three Key Breakthroughs:

    • Transparent Window: Enables non-destructive testing, reducing downtime by 30% during QA.
    • Certification Compliance: Meets RoHS and ISO standards, ensuring global regulatory acceptance.
    • Temperature Range: The Pro model’s -40°C to +105°C tolerance outperforms industry benchmarks by 25%.

  2. Optimal Version Selection:

    • Base Model: Ideal for hobbyists and small-scale projects requiring basic functionality.
    • Advanced Model: Suited for industrial users needing enhanced durability (e.g., automotive sensors).
    • Pro Model: Best for aerospace or military applications where extreme environmental resilience is critical.

With the Pro model’s tripled chemical resistance (vs. industry standards), you can safely deploy in corrosive environments. Pair its low-power design with the transparent window to achieve real-time diagnostics in field operations.

Frequently asked questions

  • Which DIP8 IC suits small electronics projects requiring easy integration?

  • Is the 190S06 IC FDA-approved for medical electronics use?

  • Why is the DIP8 package better than SMD for prototyping with the 190S06?

  • How do I clean and store the 190S06 DIP8 IC to prevent corrosion?

  • Can the 190S06 IC be customized for specific circuit designs?

  • What applications use the 190S06 DIP8 IC’s transparent window feature?

  • Why choose DONG LIAN XIN’s 190S06 over generic DIP8 ICs?

  • What’s the lead time for bulk orders of the 190S06 DIP8 IC?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Material CompositionElectrical enclosures, industrial devicesIndustry Standard: UL 94 HB ▲ Our Base: UL 94 V-2 ▲▲ Our Advanced: UL 94 V-0 (meets stringent safety standards)Enhanced fire resistance; complies with global safety regulations.Advanced materials may increase production costs.
Pin ConfigurationCircuit prototyping, PCB assemblyIndustry Standard: 2.54mm pitch ▲ Our Base: 2.54mm + gold-plated pins ▲▲ Our Advanced: 2.54mm + reinforced pins (IEC 60603-9)Improved solderability and durability; reduces connection failures.Larger footprint compared to SMD packages.
Thermal PerformanceHigh-temperature environmentsIndustry Standard: -20°C to +70°C ▲ Our Base: -40°C to +85°C ▲▲ Our Advanced: -55°C to +125°C (per JEDEC JESD51-2)Operates reliably in extreme temperatures; ideal for automotive/industrial use.Advanced versions may require additional cooling in compact designs.
Transparency for InspectionQuality control, R&D testingIndustry Standard: Opaque casing ▲ Our Base: Partial window (ISO 14643) ▲▲ Our Advanced: Full transparent window (ASTM E1350)Enables real-time component inspection; reduces testing time.Transparent windows may reduce UV resistance in prolonged exposure.
Brand IdentificationOEM manufacturing, supply chain trackingIndustry Standard: Unbranded/Basic labels ▲ Our Base: "DONG LIAN XIN" laser-etched (ISO/IEC 15414) ▲▲ Our Advanced: QR-coded labels (ISO/IEC 24728)Simplifies traceability; ensures authenticity.QR codes may require scanning infrastructure.
Power EfficiencyBattery-operated devicesIndustry Standard: 12mA quiescent current ▲ Our Base: 8mA ▲▲ Our Advanced: 5mA (per IEC 60068-2-29)Extends battery life; reduces energy costs.Lower power may limit performance in high-load scenarios.

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The comparison data is based on manufacturer information and industry standards. Actual results may vary depending on individual use cases. It is advisable to verify details with the supplier for the most accurate information.