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  • 2.8GHZ 8-core CPU Qualcomm Snapdragon 845 processor Android Industrial Development Board
  • 2.8GHZ 8-core CPU Qualcomm Snapdragon 845 processor Android Industrial Development Board
  • 2.8GHZ 8-core CPU Qualcomm Snapdragon 845 processor Android Industrial Development Board
  • 2.8GHZ 8-core CPU Qualcomm Snapdragon 845 processor Android Industrial Development Board
  • 2.8GHZ 8-core CPU Qualcomm Snapdragon 845 processor Android Industrial Development Board
  • 2.8GHZ 8-core CPU Qualcomm Snapdragon 845 processor Android Industrial Development Board
2.8GHZ 8-core CPU Qualcomm Snapdragon 845 processor Android Industrial Development Board

2.8GHZ 8-core CPU Qualcomm Snapdragon 845 processor Android Industrial Development Board

  • 1 - 499 Pieces
    $349
  • 500 - 999 Pieces
    $319
  • 1000 - 4999 Pieces
    $299
  • >= 5000 Pieces
    $279

Customization:

Customized logo（Min.Order: 100 pieces）
Customized packaging（Min.Order: 100 pieces）
Graphic customization（Min.Order: 100 pieces）
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2.8GHZ 8-core CPU Qualcomm Snapdragon 845 processor Android Industrial Development Board

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • High-Performance Computing: Equipped with a 2.8GHz 8-core Qualcomm Snapdragon 845 CPU and up to 64GB RAM, enabling seamless execution of complex applications and multitasking.
  • Multi-Interface Connectivity: Supports USB 3.0/2.0, Gigabit Ethernet, HDMI, and expansion slots, facilitating integration with peripherals and high-definition displays.

Key features

  • 1. Advanced Thermal Management with High-Performance Heatsink

    • With a large surface area heatsink for the Qualcomm Snapdragon 845 CPU, maintain stable operation under heavy computational loads* compared to passive-cooled boards.

  • 2. Versatile High-Speed Connectivity

    • With USB 3.0, Gigabit Ethernet, and HDMI interfaces, transfer data up to 10x faster than USB 2.0* and support 4K video output for seamless peripheral integration.

  • 3. Powerful 8-Core Processing for Multitasking

    • With a 2.8GHz 8-core Qualcomm Snapdragon 845 processor, outperform 4-core processors by up to 50%* in complex tasks like AI inference or real-time data analysis.

  • 4. Industrial-Grade Durability for Continuous Operation

    • Designed for 24/7 commercial use, this board handles industrial IoT and embedded systems better than consumer-grade boards* with robust power supply and thermal stability.

  • 5. Eco-Friendly Compliance with European Standards

    • Complies with EPR packing regulations in France and Germany*, ensuring reduced environmental impact compared to non-certified alternatives.

Product details

2.8GHZ 8-core CPU Qualcomm Snapdragon 845 processor Android Industrial Development Board

The Qualcomm Snapdragon 845-based industrial development board combines high-performance computing with robust connectivity, designed for industrial automation, IoT, and edge computing applications. With certifications for EU environmental standards and scalable RAM options, it delivers versatility for diverse workloads.

Technical specifications

FeatureSpecificationBenefit
CPUQualcomm Snapdragon 845, 2.8GHz, 8-coreWith high-performance processing, handle complex industrial tasks efficiently.
RAM4GB/8GB/64GBScalable memory options for varying workload demands.
OS CompatibilityAndroid 9.0Deploy custom applications seamlessly with Android ecosystem support.
CertificationsEPR France/Germany PackingMeet strict environmental regulations for EU markets.
ConnectivityUSB 3.0, USB 2.0, Gigabit Ethernet, HDMIWith USB 3.0, transfer data 20% faster than USB 2.0; support high-definition video output.
Thermal ManagementBlue heatsink with large surface areaMaintain thermal stability under heavy computational loads.
Expansion OptionsMultiple expansion slotsExtend functionality with additional modules or peripherals.

Customization guide

Adjust RAM capacity (4GB/8GB/64GB) to match specific memory requirements. Opt for EPR-certified models to comply with regional environmental regulations.

Get inspired

Whether deploying AI-driven edge computing or IoT gateways, this board’s modular design and high-speed interfaces empower scalable industrial solutions.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
RAM Capacity4GB8GB64GB
USB Ports2x USB 2.02x USB 3.04x USB 3.0
Thermal SolutionPassive CoolingEnhanced HeatsinkActive Cooling + Heatsink

Supplier's note

  1. Technical Breakthroughs:

    • The Snapdragon 845’s octa-core CPU enables simultaneous processing of sensor data and real-time analytics in smart factories.
    • EPR certifications eliminate compliance hurdles for EU deployments, reducing time-to-market.
    • The heatsink’s 30% larger surface area ensures stable operation in high-temperature industrial environments.

  2. Optimal Version Selection:

    • The Pro Model (64GB RAM + Active Cooling) is ideal for AI edge computing, where massive data processing and thermal stability are critical.
    • The Advanced Model (8GB RAM + USB 3.0) suits IoT gateways requiring fast data transfers and moderate memory.
    • The Base Model (4GB RAM) is cost-effective for basic control systems, such as environmental monitoring or simple automation.

With the Pro’s 64GB RAM, you can run resource-heavy machine learning models locally. The Advanced Model’s USB 3.0 ports enable rapid firmware updates in logistics systems. The Base Model’s compact design fits space-constrained applications like vending machines.

Frequently asked questions

  • Which RAM configuration (4GB/8GB/64GB) is best for high-performance industrial automation systems?

  • How to clean the heatsink to maintain thermal performance on the Qualcomm Snapdragon 845 development board?

  • Does the 2.8GHz 8-core CPU support multitasking in embedded systems?

  • Are the USB 3.0 and Gigabit Ethernet ports compatible with industrial IoT devices?

  • Can the board be customized with expansion modules for specific industrial applications?

  • Is Android 9.0 optimized for real-time data processing in industrial settings?

  • Does the board meet EPR packing regulations in France and Germany?

  • How does the power supply module ensure stable operation under heavy loads?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
High-Performance BoardsIndustrial Automation, RoboticsCPU: 2.8GHz 8-core (Qualcomm Snapdragon 845) ▲ vs Industry (2.0GHz 4-core)Superior multitasking, faster processingHigher power consumption, cost
Android-Based BoardsIoT Devices, Smart Home SystemsOS: Android 9.0 (supports modern apps) vs Industry (Linux)User-friendly, app compatibilityHigher resource use, less customization
High-Memory BoardsData-Intensive Apps, MultimediaRAM: 64GB (Advanced) ▲▲ vs 4GB (Base), Industry (8GB)Handles large datasets efficientlyHigher cost, larger form factor
EPR-Certified ElectronicsEU Compliance MarketsCertifications: EPR France/Germany Packing ▲ vs Industry (No EPR)Meets strict environmental regulationsLimited to specific regions
Connectivity-Focused BoardsNetworked SystemsInterfaces: USB 3.0, Gigabit Ethernet, HDMI ▲ vs Industry (USB 2.0, Ethernet)Faster data transfer, versatile connectivityMore complex setup, higher cost
Thermal Management Boards24/7 Operations, High-Load AppsHeatsink with large surface area ▲ vs Industry (passive cooling)Better thermal stability, reliabilityIncreased weight, cost

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