Package Type | Prototyping, educational circuits | Industry Standard: DIP8 (standard for manual handling) Our Base: DIP8 Our Advanced: DIP8 + SMT option (▲20% smaller footprint) | Easy soldering for hobbyists Advanced: Dual compatibility for prototyping and mass production | Larger footprint than SMT-only chips Advanced: Higher cost due to dual packaging |
Memory Capacity | IoT data logging, embedded systems | Industry Standard: 1Kb EEPROM Our Base: 2Kb (▲100%) Our Advanced: 4Kb (▲300%) | Stores 256 8-bit words (Base) Advanced: Doubles storage for complex applications | Limited scalability beyond 4Kb Advanced: 20% higher price point |
Operating Voltage | Battery-operated devices | Industry Standard: 5V Our Base: 1.7–5.5V (▲30% wider range) Our Advanced: 1.5–5.5V (▲13% lower min) | Works with Li-ion (3.7V) and alkaline batteries Advanced: Supports ultra-low-power MCUs | Requires voltage regulation for sub-1.7V systems |
Power Consumption | Wearables, portable electronics | Industry Standard: 2mA @5V Our Base: 1mA @5V (▲50% lower) Our Advanced: 0.5mA @5V (▲75% lower) | Base: 1mA max (ISO 17025 certified) Advanced: Prolongs battery life by 40% | Minimal impact on high-power applications |
Temperature Range | Industrial automation | Industry Standard: 0°C to +70°C Our Base: -40°C to +85°C (▲60% broader) Our Advanced: -55°C to +125°C (▲114% broader) | Survives extreme environments (e.g., automotive) Advanced: MIL-STD-810G compliant | Requires thermal management for extreme use |
Compliance Standards | Medical devices, aerospace | Industry Standard: RoHS Our Base: RoHS + AEC-Q100 (▲ automotive-grade) Our Advanced: RoHS + MIL-STD-810 (▲ ruggedized) | Base: Qualified for automotive electronics Advanced: Withstands shock/vibration (e.g., drones) | Advanced: 30% longer lead times due to testing |