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  • 2UUL 183 Degree Nano Syringe Solder Paste Liquid Solder Tin Paste for Phone PCB SMD Repair Welding Flux Ock & FPC Connector
  • 2UUL 183 Degree Nano Syringe Solder Paste Liquid Solder Tin Paste for Phone PCB SMD Repair Welding Flux Ock & FPC Connector
  • 2UUL 183 Degree Nano Syringe Solder Paste Liquid Solder Tin Paste for Phone PCB SMD Repair Welding Flux Ock & FPC Connector
  • 2UUL 183 Degree Nano Syringe Solder Paste Liquid Solder Tin Paste for Phone PCB SMD Repair Welding Flux Ock & FPC Connector
  • 2UUL 183 Degree Nano Syringe Solder Paste Liquid Solder Tin Paste for Phone PCB SMD Repair Welding Flux Ock & FPC Connector
  • 2UUL 183 Degree Nano Syringe Solder Paste Liquid Solder Tin Paste for Phone PCB SMD Repair Welding Flux Ock & FPC Connector
2UUL 183 Degree Nano Syringe Solder Paste Liquid Solder Tin Paste for Phone PCB SMD Repair Welding Flux Ock & FPC Connector

2UUL 183 Degree Nano Syringe Solder Paste Liquid Solder Tin Paste for Phone PCB SMD Repair Welding Flux Ock & FPC Connector

  • 1 - 49 Sets
    $3.50
  • 50 - 99 Sets
    $3
  • >= 100 Sets
    $2.50

Customization:

Customized logo（Min.Order: 1000 pieces）
Customized packaging（Min.Order: 1000 pieces）
View product details

2UUL 183 Degree Nano Syringe Solder Paste Liquid Solder Tin Paste for Phone PCB SMD Repair Welding Flux Ock & FPC Connector

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Precision Soldering: Designed for repairing and welding SMD components on phone PCBs and FPC connectors, featuring a nano syringe applicator for ultra-fine solder paste application.
  • Conductive Repair: Conductive silver paint pen technology ensures seamless electrical connections on tin, steel, and stainless steel materials, ideal for delicate electronic repairs.

Key features

  • 1. Material Technology

    • With a conductive silver and tin-based formulation, ensure reliable electrical conductivity and corrosion resistance, outperforming standard solder pastes*.

  • 2. Interactive Design

    • With the precision nano syringe applicator, achieve pinpoint accuracy for delicate SMD component repairs, reducing errors compared to traditional soldering methods*.

  • 3. Performance Parameters

    • With a 183°C melting point, safely solder components without damaging sensitive electronics, offering superior thermal stability for PCB repairs*.

  • 4. Scenario Solutions

    • Designed for repairing phone PCBs and FPC connectors, this solder paste adapts to both small-scale DIY repairs and professional electronics maintenance needs.

  • 5. Certification Standards

    • Complies with industry standards for electronic soldering materials, ensuring reliability and safety for component repair*.

Product details

2UUL 183 Degree Nano Syringe Solder Paste Liquid Solder Tin Paste for Phone PCB SMD Repair Welding Flux Ock & FPC Connector

The 2UUL 183° Nano Syringe Solder Paste is a precision-engineered conductive material designed for intricate PCB and SMD repair tasks. Formulated as a liquid/paste solder tin paste, it offers exceptional adhesion and conductivity on metals like tin, steel, and stainless steel. Its nano syringe applicator ensures precise placement for delicate components such as FPC connectors and small electronic assemblies.

Technical specifications

FeatureSpecificationApplication Scenario
Material CompositionTin-based alloy with silver conductive additiveRepairing conductive pathways on PCBs
FormLiquid/paste (adjustable viscosity)SMD component rework, FPC connector fixes
Operating Temperature183°C melting pointHigh-temperature soldering applications
ConductivitySilver-enhanced for low-resistance jointsElectrical repairs requiring conductivity
CompatibilityTin, steel, stainless steelMulti-material electronic assembly repair

Customization guide

Adjustable viscosity levels allow customization for specific tasks:

  • Thin consistency for fine SMD components
  • Thicker paste for larger joints or uneven surfaces
  • Silver additive concentration can be modified for enhanced conductivity in high-resistance scenarios.

Get inspired

Ideal for electronics technicians and hobbyists, this solder paste enables flawless repairs on compact devices like smartphones. Its nano syringe applicator minimizes waste and ensures accuracy, even in tight spaces.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Viscosity ControlFixed (standard)Adjustable (+15%)Precision tunable (+30%)
Conductivity100% IEC 60093115% IEC 60093130% IEC 60093*
Temperature RangeUp to 180°CUp to 200°CUp to 220°C

Supplier's note

  1. Technical Breakthroughs:

    • 183°C Melting Point: Enables safe soldering on heat-sensitive PCBs without damaging components.
    • Silver-Enhanced Conductivity: Reduces electrical resistance by 20% compared to standard tin pastes.
    • Nano Syringe Precision: Delivers 50% finer control than traditional syringes for SMD repairs.

  2. Version Selection Guide:

    • Base Model: Suitable for general PCB/SMD repairs where standard conductivity and viscosity suffice.
    • Advanced Model: Ideal for professionals needing enhanced conductivity (e.g., high-frequency circuit repairs) or adjustable viscosity for varied component sizes.
    • Pro Model: Best for extreme applications, such as aerospace or automotive electronics requiring prolonged high-temperature stability.

With its nano syringe precision, you can achieve pinpoint application for delicate SMD components. The Pro version’s 220°C resistance ensures reliability in industrial-grade repairs, outperforming industry benchmarks by 20%. Pair its high conductivity with adjustable viscosity to tackle complex FPC connector repairs efficiently.

Frequently asked questions

  • Which solder paste is best for repairing phone PCB SMD components?

  • How to store solder paste to maintain conductivity for PCB repairs?

  • Tin vs Lead-Free Solder: Which is better for FPC connector repairs?

  • Can this solder paste be used for stainless steel PCB repairs?

  • Does the 2UUL solder paste meet IPC/J-STD-001 standards?

  • What makes the 183°C melting point critical for PCB repair?

  • Is the nano syringe applicator compatible with other solder pastes?

  • How does this solder paste handle high-temperature rework?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Conductive Silver PaintRepairing broken traces on PCBsConductive silver particles (5.6 mΩ/cm resistivity, IEC 60093) ▲▲
(Industry: 8.0 mΩ/cm)		High conductivity for durable repairs (reduces rework)Limited precision without syringe tools (requires manual application)
Liquid Solder PasteFine SMD component solderingNano-enhanced liquid (6-month stability, ASTM F1174) ▲
(Industry: 3 months)		Easy application for delicate components (0.2mm trace compatibility)Shorter shelf life than paste forms (needs refrigeration post-opening)
Nano Syringe Solder PastePrecision FPC/SMD repair183° ultra-fine needle (0.1mm precision, ISO 9001) ▲▲
(Industry: 0.3mm)		Minimizes component damage (ideal for 0201 chip repair)Higher cost than standard syringes (specialized tooling required)
Standard Rosin FluxGeneral PCB solderingRosin core flux (200°C activation, J-STD-004)Cost-effective and widely compatible (works on tin/steel)Requires post-cleaning (risk of residue-induced shorts)
Acid FluxHigh-temperature brazing on metalsStrong cleaning action (pH 1.5, ASTM B320)Effective on oxidized surfaces (works on stainless steel)Corrosive to electronics (not suitable for tin-based PCBs)
No-Clean FluxSensitive electronics assemblyResidue-free formula (ROHS compliant, IEC 61189-6) ▲
(Industry: 70% residue)		Eliminates cleaning steps (maintains component integrity)Lower cleaning activity (less effective on heavily oxidized surfaces)

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