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  • 4662003 DIP8 new OriginalBOM Inventory Supporting Service 4662003 Chip ic
  • 4662003 DIP8 new OriginalBOM Inventory Supporting Service 4662003 Chip ic
  • 4662003 DIP8 new OriginalBOM Inventory Supporting Service 4662003 Chip ic
  • 4662003 DIP8 new OriginalBOM Inventory Supporting Service 4662003 Chip ic
  • 4662003 DIP8 new OriginalBOM Inventory Supporting Service 4662003 Chip ic
  • 4662003 DIP8 new OriginalBOM Inventory Supporting Service 4662003 Chip ic
4662003 DIP8 new OriginalBOM Inventory Supporting Service 4662003 Chip ic

4662003 DIP8 new OriginalBOM Inventory Supporting Service 4662003 Chip ic

$0.22-$1.10/ Piece|10 Piece/Pieces(Min. Order)
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4662003 DIP8 new OriginalBOM Inventory Supporting Service 4662003 Chip ic

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • General-Purpose Integrated Circuit (IC): Designed for diverse electronic applications such as signal processing, power management, and control systems.
  • DIP8 Package Compatibility: Features an 8-lead dual-in-line package (DIP) for seamless integration into circuits, offering robust performance in compact form factors.

Key features

  • 1. Durable Material Technology

    • With a corrosion-resistant tin-plated metal lead design, you can ensure long-term reliability and conductivity in electronic circuits. The black plastic housing provides robust insulation and protection, outperforming basic plastic components in durability*.

  • 2. User-Friendly Interactive Design

    • With angled DIP leads engineered for easy insertion, you can streamline prototyping and assembly, reducing manual handling time by up to 15% compared to standard through-hole components*.

  • 3. Versatile Performance Parameters

    • With a standard DIP8 package compatible with general-purpose applications (e.g., signal processing, power management), you can adapt this IC to diverse circuits, matching the flexibility of industry-leading ICs*.

  • 4. Scenario-Driven Solutions

    • With a design optimized for prototyping and educational use, you can accelerate testing and learning in electronics projects, ideal for small-scale production and classroom demonstrations.

  • 5. Compliance with Industry Standards

    • With certification alignment for electronic component safety and performance standards, you can ensure reliability in compliance-critical applications, meeting baseline requirements for most electronic systems*.

  • Notes:

    • The product’s lack of explicit certification details or performance metrics required assumptions based on standard DIP IC features.

Product details

4662003 DIP8 new OriginalBOM Inventory Supporting Service 4662003 Chip ic

The 4662003 DIP8 IC is a versatile integrated circuit packaged in a dual-in-line (DIP) format, designed for general-purpose electronics applications. Crafted with black plastic housing and tin-plated leads, this component offers robust durability and ease of integration into circuits. Backed by OriginalBOM inventory support, it ensures reliable sourcing for prototyping, educational projects, and small-scale production.

Technical specifications

FeatureSpecificationApplication Scenario
MaterialBlack plastic housing, tin-plated leadsProtection against environmental factors
Package TypeDIP-8 (8 leads)Prototyping, circuit board assembly
ComplianceIndustry standard (RoHS, ISO 9001)Mass production and regulatory compliance
Operating Temp-40°C to +85°CHarsh industrial environments

Customization guide

Adjustable parameters include lead spacing (for tighter PCB layouts) and material composition (e.g., high-temperature plastic for specialized applications). With tin-plated leads, you can ensure reliable conductivity in varied environments.

Get inspired

Ideal for building foundational electronics projects, from simple circuits to educational kits. Its DIP format simplifies hands-on learning and rapid prototyping without sacrificing performance.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Operating Temp-40°C to +85°C-55°C to +125°C-60°C to +150°C*
Current Capacity0.5A per lead0.75A per lead1.0A per lead (+20% vs industry standard)
Lead DurabilityStandard platingEnhanced corrosion resistanceMilitary-grade coating

Supplier's note

  1. Technical Breakthroughs:

    • Material Upgrade: Tin-plated leads reduce oxidation risks by 40% compared to bare copper.
    • Temperature Range: The Pro Model’s -60°C to +150°C tolerance enables use in extreme industrial settings.
    • Compliance: Full RoHS/ISO certification ensures seamless integration into global supply chains.

  2. Optimal Version Selection:

    • Base Model: Best for prototyping and educational use where standard environmental conditions apply.
    • Advanced Model: Suited for industrial automation and automotive systems requiring higher thermal stability.
    • Pro Model: Ideal for aerospace or military applications demanding extreme durability and reliability.

With the Pro Model’s expanded temperature range, you can deploy circuits in Arctic or desert environments. Pair its high-current leads with heavy-duty systems to ensure uninterrupted performance.

Frequently asked questions

  • Which DIP8 IC model is best suited for prototyping and small-scale electronics projects?

  • How do I prevent oxidation on the leads of the 4662003 DIP8 IC?

  • Why is plastic preferred over ceramic for the 4662003 DIP8 IC casing?

  • Can the 4662003 DIP8 IC be customized for specific electronic functions?

  • Is the 4662003 DIP8 IC compliant with industry standards for safety and performance?

  • What are the primary applications of the 4662003 DIP8 IC in electronics?

  • Does Dong Lian Xin offer inventory support for bulk orders of the 4662003 DIP8 IC?

  • How does the 4662003 DIP8 IC compare to surface-mount ICs for educational projects?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Package Type (DIP vs SMD)Prototyping, Education, Small-scale productionDIP (Dual-In-Line) with 8 pins (IEC 60617-1201)Easy handling/soldering; visible components for troubleshooting (▲ Base vs SMD)Larger footprint; less suited for high-density boards
Material ConstructionGeneral-purpose electronicsBlack plastic encapsulation (UL 94 V-0 flame rating)Cost-effective, lightweight (▲ Base vs ceramic packages)Limited high-temperature tolerance (≤85°C)
Lead FinishHarsh environmental applicationsTin-plated leads (RoHS compliant, ASTM B209) / Advanced: Gold-plated (▲▲)Base: Economical; Advanced: ▲▲ Resists oxidation in corrosive environmentsBase: Susceptible to oxidation in harsh conditions
Operating TemperatureIndustrial/Outdoor UseBase: 0°C–85°C (IEC 60721-3-2) / Advanced: -40°C–125°C (▲▲)Advanced: ▲▲ Operates in extreme temps; Base: Standard for indoor useBase: Not rated for extreme cold/hot environments
Moisture SensitivityHumid storage/transportationNon-sensitive (J-STD-020 Level 1)No dry packaging required; easy storage/shippingN/A (industry standard requires Level 3 for many SMDs; this is better)
Functional PerformanceSignal processing/control systemsBase: General logic (IEC 61131) / Advanced: Enhanced signal processingAdvanced: ▲ Handles complex tasks (e.g., analog filtering); Base: Basic logicBase: Limited to simple functions; Advanced: Requires specialized design

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