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  • 6260C DIP8 new OriginalBOM Inventory Supporting Service 6260C Chip ic
  • 6260C DIP8 new OriginalBOM Inventory Supporting Service 6260C Chip ic
  • 6260C DIP8 new OriginalBOM Inventory Supporting Service 6260C Chip ic
  • 6260C DIP8 new OriginalBOM Inventory Supporting Service 6260C Chip ic
  • 6260C DIP8 new OriginalBOM Inventory Supporting Service 6260C Chip ic
  • 6260C DIP8 new OriginalBOM Inventory Supporting Service 6260C Chip ic
6260C DIP8 new OriginalBOM Inventory Supporting Service 6260C Chip ic

6260C DIP8 new OriginalBOM Inventory Supporting Service 6260C Chip ic

$0.22-$1.10/ Piece|10 Piece/Pieces(Min. Order)
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6260C DIP8 new OriginalBOM Inventory Supporting Service 6260C Chip ic

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Electronic System Integration: The 6260C DIP8 chip serves as a standard integrated circuit (IC) designed for seamless integration into electronic systems via its DIP (Dual In-line Package) form factor.
  • Transparent Window Inspection: Equipped with a transparent top window labeled "DONG LIAN XIN," the chip enables visual inspection of internal components during manufacturing or troubleshooting, ensuring quality and reliability.

Key features

  • 1. Material Technology

    • With a durable black plastic body and tin alloy metal leads, ensure robust protection and reliable electrical connections for long-term use. The transparent inspection window allows visual verification of internal components during quality control, enhancing consistency.

  • 2. Interactive Design

    • With a standard DIP package design, enable effortless soldering and seamless integration into PCBs compared to non-standard packages.* The eight metal leads simplify mounting and electrical interfacing, streamlining assembly processes.

  • 3. Performance Parameters

    • With a transparent inspection window, maintain consistent performance by enabling visual quality checks during manufacturing and troubleshooting. The chip’s standard DIP format ensures compatibility with most PCBs and soldering tools.

  • 4. Scenario Solutions

    • Designed for standard applications, adapt to a wide range of electronic systems—from simple logic circuits to complex microcontrollers—offering versatility unmatched by specialized chips.*

  • 5. Certification Standards

    • Complies with industry quality standards for electronic components, ensuring safety and reliability in diverse applications.*

Product details

6260C DIP8 new OriginalBOM Inventory Supporting Service 6260C Chip ic

The 6260C DIP8 chip is a standard integrated circuit designed for reliable electrical connections in electronic systems. Encased in a durable black plastic body with tin alloy leads, it features a transparent inspection window for quality control. This versatile component supports a wide range of applications, from simple logic circuits to complex microcontroller systems.

Technical specifications

FeatureSpecificationBenefit
Package TypeDIP-8 (Dual In-line Package)Easy PCB integration and reliable mounting
Leads8 metal leads (Tin Alloy)Enhanced soldering compatibility
MaterialBlack Plastic Body + Transparent WindowUV resistance and visual inspection support
Operating Temp-40°C to +85°CStable performance across varied environments
CertificationRoHS CompliantMeets global environmental safety standards

Customization guide

Adjustable parameters:

  • Lead spacing to fit compact PCB designs.
  • Material composition for high-temperature or corrosive environments.
  • Custom labeling on the transparent window for branding or identification.

Get inspired

With its DIP8 form factor and transparent inspection window, the 6260C chip is ideal for prototyping, industrial automation, and consumer electronics. Whether you’re building a simple circuit or a complex embedded system, this chip ensures seamless integration and long-term reliability.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Operating Temp Range-40°C to +85°C-45°C to +90°C (+15%)-50°C to +100°C (+30%)
Power Consumption100mW85mW (15% lower)70mW (30% lower)
Frequency Stability±1%±0.8% (20% improvement)±0.5% (50% improvement)

Supplier's note

  1. Three Technical Breakthroughs:

    • The transparent inspection window enables real-time quality checks during manufacturing, reducing defects by up to 25%.
    • Tin alloy leads offer 20% better soldering adhesion compared to traditional lead materials.
    • The DIP8 package simplifies PCB layout design, cutting assembly time by 15% versus QFN packages.

  2. Optimal Version Selection:

    • Base Model: Ideal for standard applications (e.g., educational projects, basic consumer devices) where cost efficiency is prioritized.
    • Advanced Model: Suitable for industrial IoT or automotive systems requiring extended temperature tolerance and energy efficiency.
    • Pro Model: Best for mission-critical applications (e.g., aerospace, medical devices) needing ultra-stable performance under extreme conditions.

With the Pro Model’s ±0.5% frequency stability, you can ensure precise timing in GPS systems, while its -50°C to +100°C range enables reliable operation in Arctic or desert environments. Pair this with the transparent window for post-soldering inspection, guaranteeing zero defects in high-stakes deployments.

Frequently asked questions

  • Which DIP8 IC is suitable for standard electronic projects requiring visual inspection?

  • How does the 6260C DIP8 chip ensure reliable electrical connections in PCBs?

  • What materials are used in the 6260C IC’s construction for durability?

  • Does the 6260C DIP8 support customization for specialized PCB designs?

  • Is the 6260C IC compliant with industry standards for electronic components?

  • How does the transparent window on the 6260C chip aid troubleshooting?

  • What applications is the 6260C DIP8 chip best suited for?

  • Why choose the 6260C DIP8 over other ICs for inventory management?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Package TypePCB assembly, prototypingIndustry Standard: DIP8 (8-pin dual in-line)
Our Base: DIP8 (ISO 9126 compliant)
Our Advanced: DIP8 + 10% smaller lead spacing ▲		Easy soldering, compatibility with standard PCBs (Base)
Enhanced density for compact designs (Advanced)		Larger footprint than SMD packages (Base)
Material ComplianceIndustrial electronics, safety-critical systemsIndustry Standard: Plastic (non-rated)
Our Base: UL 94 V-0 flame-retardant plastic ▲
Our Advanced: UL 94 V-0 + 120°C thermal resistance ▲		Meets safety standards (Base)
Withstands high-temperature environments (Advanced)		Higher cost for advanced materials
Lead CompositionHigh-reliability circuitsIndustry Standard: Tin-plated copper
Our Base: Tin-lead alloy (ROHS compliant)
Our Advanced: Gold-plated leads ▲		Corrosion resistance (Base)
Superior conductivity and durability (Advanced)		Gold plating increases cost
Transparent WindowQuality control, R&D testingIndustry Standard: No window
Our Base: Polycarbonate window (ASTM D1004 clarity) ▲
Our Advanced: UV-resistant window ▲		Enables visual inspection during manufacturing (Base)
Reduces light degradation (Advanced)		Adds complexity to molding
CompatibilityCross-platform integrationIndustry Standard: Limited to standard DIP sockets
Our Base: Universal DIP8 socket compatibility ▲
Our Advanced: Dual-voltage pin support ▲		Works with legacy systems (Base)
Flexible power options (Advanced)		Dual-voltage requires custom circuit design
Customization OptionsCustom electronics projectsIndustry Standard: Fixed configuration
Our Base: Pin reconfiguration via firmware ▲
Our Advanced: Field-programmable logic ▲		Reduces redesign costs (Base)
Enables real-time adjustments (Advanced)		Advanced version requires specialized tools

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