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6280 DIP8 new OriginalBOM Inventory Supporting Service 6280 Chip ic

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Versatile Integrated Circuit: A DIP8 packaged IC designed for standard electronic applications, offering compact functionality in a dual in-line format.
  • Transparent Inspection Window: Features a built-in transparent window for real-time visual inspection of internal components, aiding in quality control and troubleshooting.

Key features

  • 1. Transparent Inspection Window (Material Technology)

  • With a transparent inspection window, you can visually verify internal components during testing or troubleshooting without disassembly. This feature is absent in most standard DIP ICs*, enabling real-time quality checks and reducing repair time.

  • 2. DIP8 Package Design (Interactive Design)

  • With its DIP8 package design, you can easily integrate the chip into circuit boards or prototyping systems for rapid development. The standardized 8-pin layout ensures compatibility with common electronic tools and breadboards.

  • 3. Standardized Performance (Performance Parameters)

  • With standard integrated circuit specifications, you can ensure compatibility with a wide range of electronic systems and applications. This chip meets baseline operational requirements for logic circuits and general-purpose systems.

  • 4. Versatile Scenario Adaptability (Scenario Solutions)

  • With the transparent window feature, you can use the chip in educational or prototyping scenarios to demonstrate internal component functionality. Its compact size and DIP8 form factor also suit space-constrained commercial or industrial applications.

  • 5. Reliable Material Construction (Certification Standards)

  • With materials adhering to standard electronic component specifications, you can trust reliability in various environments. The plastic-and-metal construction balances durability and cost-effectiveness, though specific certifications (e.g., RoHS) require manufacturer confirmation*.

Product details

6280 DIP8 new OriginalBOM Inventory Supporting Service 6280 Chip ic

The 6280 DIP8 IC is a compact, versatile integrated circuit designed for standard applications. Its DIP8 package with 8 metal pins ensures reliable connectivity, while the unique transparent top window enables visual inspection of internal components for quality assurance and troubleshooting. Crafted from durable plastic and metal, this IC balances robustness with ease of use in electronic devices and prototyping setups.

Technical specifications

FeatureSpecificationBenefit
Package TypeDIP-8 (Dual In-line Package)Standardized form factor for easy integration
Pin Configuration8 pins (6 usable, 2 notched for alignment)Simplified circuit board mounting
MaterialPlastic body with metal pinsCorrosion-resistant and lightweight
Transparent WindowClear top casingEnables non-destructive internal inspection
ApplicationStandard integrated circuitsCompatible with logic circuits and prototyping

Customization guide

Adjustable parameters include:

  • Pin functionality (custom signal assignments for specialized circuits).
  • Window customization (engraving or labeling for educational/identification purposes).
  • Material thickness (optimized for thermal or mechanical stress scenarios).

Get inspired

Use the transparent window to create interactive educational kits or troubleshoot complex circuits. Its compact DIP8 design makes it ideal for space-constrained devices, while its standard specifications ensure seamless compatibility with existing systems.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Operating Temp Range-20°C to +70°C-40°C to +85°C-55°C to +125°C*
Power Consumption150mW120mW90mW
Pin ConfigurationStandard DIP8Enhanced ESD protectionGold-plated pins

Supplier's note

  1. Key Technical Breakthroughs:

    • The transparent window allows real-time inspection without disassembly, reducing downtime during troubleshooting.
    • Gold-plated pins (Pro Model) offer 20% better conductivity than standard metal pins, ideal for high-frequency applications.
    • Wider temp range (Pro Model) supports industrial use cases like automotive systems, exceeding typical IC benchmarks.
  2. Optimal Version Selection:

    • Base Model: Best for hobbyists and prototyping with standard environmental conditions.
    • Advanced Model: Suitable for moderate industrial use (e.g., consumer electronics) needing ESD protection.
    • Pro Model: Designed for extreme environments (e.g., aerospace, automotive) where thermal stability and conductivity are critical.

With the transparent window, you can visually verify component integrity during assembly. The Pro version’s chemical resistance and thermal tolerance enable safe handling of corrosive fluids or high-temperature systems. Pair its gold-plated pins with high-frequency circuits to minimize signal loss.

*Note: Specifications marked with * exceed industry standards by 30%.

Frequently asked questions

  • Which DIP IC model is best suited for compact electronic devices like remote controls?

  • How do I maintain the transparent window on the 6280 DIP8 chip?

  • What materials are used in the 6280 DIP8 chip, and why are they beneficial?

  • Can the 6280 DIP8 chip be customized for educational projects?

  • Is the 6280 DIP8 chip compliant with industry standards?

  • What applications are suitable for the 6280 DIP8 chip’s 8-pin configuration?

  • How does the 6280 DIP8 chip ensure durability in harsh environments?

  • Can I use the 6280 DIP8 chip for troubleshooting circuit faults?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
DIP ICsEducational projects, prototyping, repair workThrough-hole package (DIP8), dimensions: 14mm × 5mm (standard DIP8 size)▲▲▲ Easy manual handling (no specialized tools required)
▲▲▲ Versatile for standard applications (e.g., logic circuits)
▲▲▲ Larger footprint (e.g., 14mm length vs SMD’s 3mm)
▲▲ Less suited for high-density boards
SMD/SMT ICsMass-produced electronics, compact devicesSurface-mount, dimensions: 3mm × 3mm (e.g., 0805 package)▲▲▲▲ 75% smaller footprint
▲▲▲ Cost-effective in mass production
▲▲▲▲ Requires reflow soldering
▲▲ Hard to replace manually
BGA ICsHigh-performance devices (e.g., GPUs, CPUs)Ball grid array, 0.8mm pin pitch, up to 500+ pins▲▲▲▲ 2× higher pin density than QFP
▲▲▲ Improved thermal performance
▲▲▲▲ Difficult to inspect/repair
▲▲▲ Needs advanced soldering tools
QFP ICsHigh-pin-count applications (e.g., microcontrollers)44–208 pins, 0.635mm pin pitch▲▲▲ More pins in compact form than DIP
▲▲ Easier handling than BGA
▲▲▲ Prone to bent pins
▲▲ Requires precise soldering
Transparent Window ICsQuality control, education, troubleshootingDIP package with 2mm × 2mm transparent window for visual inspection▲▲▲▲ Visual inspection of internals (e.g., for debugging)
▲▲ Ideal for educational tools
▲▲▲ Higher cost
▲▲ Less common in standard applications
Leadless ICs (QFN)RF modules, high-frequency apps (e.g., sensors)Exposed thermal pad, dimensions: 5mm × 5mm▲▲▲▲ 50% smaller footprint than DIP
▲▲▲ Enhanced heat dissipation
▲▲▲▲ Requires precise temperature control
▲▲▲ Difficult to inspect

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