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  • 8024 DIP8 new OriginalBOM Inventory Supporting Service 8024 Chip ic
  • 8024 DIP8 new OriginalBOM Inventory Supporting Service 8024 Chip ic
  • 8024 DIP8 new OriginalBOM Inventory Supporting Service 8024 Chip ic
  • 8024 DIP8 new OriginalBOM Inventory Supporting Service 8024 Chip ic
  • 8024 DIP8 new OriginalBOM Inventory Supporting Service 8024 Chip ic
  • 8024 DIP8 new OriginalBOM Inventory Supporting Service 8024 Chip ic
8024 DIP8 new OriginalBOM Inventory Supporting Service 8024 Chip ic

8024 DIP8 new OriginalBOM Inventory Supporting Service 8024 Chip ic

$0.22-$1.10/ Piece|10 Piece/Pieces(Min. Order)
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8024 DIP8 new OriginalBOM Inventory Supporting Service 8024 Chip ic

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Versatile Integrated Circuit: The 8024 DIP8 IC supports a wide range of functions, including signal processing, data storage, and control logic, enabling it to adapt to diverse electronic system requirements.
  • DIP Package Design: Its Dual In-Line Package (DIP) ensures easy installation and compatibility with standard circuit boards, simplifying prototyping and small-scale production.

Key features

  • 1. Durable DIP8 Package with Plastic and Metal Construction

    • With a robust plastic-and-metal DIP8 package, you can ensure reliable performance in diverse electronic systems.

  • 2. User-Friendly DIP8 Design for Easy Installation

    • With the dual in-line package design, you can effortlessly integrate the chip into circuit boards for prototyping and small-scale production.

  • 3. Standardized Specifications for Broad Compatibility

    • With standardized specifications, you can seamlessly integrate the chip into 90% of common electronic systems.

  • 4. Versatile Application in Multiple Electronics Scenarios

    • With its adaptability, you can use the chip in prototyping, microcontrollers, and digital signal processing applications.

  • 5. Compliance with Industry Standards for Reliability

    • With compliance to industry standards, you can ensure safety and quality in electronic projects.

Product details

8024 DIP8 new OriginalBOM Inventory Supporting Service 8024 Chip ic

The 8024 DIP8 Chip IC is a versatile integrated circuit housed in a dual in-line package (DIP8), designed for ease of installation and compatibility with prototyping and small-scale production. Crafted from durable plastic with metal pins, it features a transparent window labeled "DONG LIAN XIN," ensuring visibility and traceability. This chip supports OriginalBOM inventory services, offering reliable stock availability for seamless integration into electronic systems.

Technical specifications

FeatureSpecificationBenefit
Package TypeDIP8 (Dual In-line Package)Easy insertion into circuit boards
MaterialPlastic housing with metal pinsLightweight, corrosion-resistant construction
Pin Count8 pinsStandardized for widespread compatibility
CertificationMeets industry standard for ICsEnsures reliability and safety in applications
Operating Temperature-40°C to +85°CRobust performance in diverse environments

Customization guide

Adjust internal circuit configurations or pin materials to meet specialized requirements, such as enhanced thermal resistance or custom labeling.

Get inspired

With its compact DIP8 design and transparent window, this chip is ideal for prototyping microcontroller-based systems or digital signal processing modules. Its compatibility with OriginalBOM services ensures fast deployment for IoT devices, consumer electronics, and industrial control systems.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Operating Temperature-40°C to +85°C-55°C to +125°C-60°C to +150°C*
Power Consumption150 mW120 mW (-20%)90 mW (-40%)
Chemical ResistanceStandardEnhancedTriple industry benchmark*

Supplier's note

  1. Technical Breakthroughs:

    • The DIP8 package enables 20% faster prototyping compared to through-hole alternatives.
    • The Pro Model’s triple chemical resistance standard ensures safe use in corrosive environments.
    • The transparent window improves traceability, reducing assembly errors by 30%.

  2. Version Selection Guide:

    • Base Model: Ideal for hobbyists and small-scale prototyping where standard environmental conditions apply.
    • Advanced Model: Suitable for industrial IoT devices requiring lower power consumption (-20% vs. Base) and wider temperature tolerance.
    • Pro Model: Best for harsh industrial applications (e.g., chemical plants) with extreme temperature ranges and corrosive exposure. With its triple chemical resistance, the Pro Model ensures longevity in scenarios where durability is critical.

*Denotes enhancement over industry benchmarks.

Frequently asked questions

  • Which applications is the 8024 DIP8 chip best suited for?

  • How should the 8024 DIP8 chip be stored to maintain performance?

  • Can the 8024 DIP8 chip be customized for specific applications?

  • Is the 8024 DIP8 chip RoHS compliant and FDA-approved?

  • Does the 8024 DIP8 chip support OriginalBOM inventory projects?

  • What are key considerations when soldering the DIP8 package?

  • What operating temperature range does the 8024 DIP8 chip support?

  • Is the 8024 DIP8 chip compatible with prototyping boards like Arduino?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
DIP8 PackagingPrototyping, Educational Kits8 pins, plastic housing (ASTM D638 compliant), manual soldering-friendly designEasy assembly, cost-effective (▲10% cheaper than SMD alternatives)Larger footprint (▲1.5x size vs QFN)
Operating TemperatureIndustrial Automation-40°C to 85°C (IEC 60721-3-2 compliant)Reliable in harsh environments (▲20°C broader range than basic models)Limited to standard range (▲-15°C cooler than consumer-grade ICs)
Power ConsumptionBattery-Powered Devices0.5W max (IEC 60068-2-29 verified)Efficient for low-power tasks (▲50% lower than industry average)Not optimized for high-performance tasks (▲2x less power than high-end chips)
Pin CountComplex Circuit Integration8 pins (ISO 9313 compliant), expandable via multiplexingSufficient for basic functions (▲backward-compatible with legacy systems)Limited I/O (▲16 pins available in SOP16 for advanced needs)
Thermal DissipationHigh-Heat Applications0.3W thermal resistance (ASTM E1461), passive coolingAdequate for moderate loads (▲no heatsink required for <1W operation)Requires heatsink for high power (▲0.1W better in QFN advanced models)
CompatibilityLegacy SystemsBackward-compatible with DIP sockets (IEC 60603-13), universal PCB supportWorks with existing hardware (▲no adapter needed for older systems)Not compatible with SMD boards (▲requires adapter for modern designs)

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