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  • A393F New Original Chip ic
  • A393F New Original Chip ic
  • A393F New Original Chip ic
  • A393F New Original Chip ic
  • A393F New Original Chip ic
  • A393F New Original Chip ic
A393F New Original Chip ic

A393F New Original Chip ic

$0.19-$0.97/ Piece|10 Piece/Pieces(Min. Order)
View product details

A393F New Original Chip ic

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • High-Performance Signal Processing: Designed to support advanced digital and analog signal processing tasks, enabling efficient data transmission and control in complex systems.
  • Versatile Connectivity Support: Integrates multi-functional interfaces for seamless compatibility with modern electronic devices and IoT ecosystems.

Key features

  • 1. Material Technology

    • With a corrosion-resistant metal substrate, ensure reliable operation in harsh industrial environments.

  • 2. Interactive Design

    • With a Ball Grid Array (BGA) design, achieve secure surface mounting and high-density integration.

  • 3. Performance Parameters

    • With a high-speed processing core, process data 30% faster than conventional ICs.

  • 4. Scenario Solutions

    • Optimized for high-power applications, ensuring stable performance in demanding industrial settings.

  • 5. Certification Standards

    • With RoHS compliance certification, meet strict environmental regulations while ensuring safety.

Product details

A393F New Original Chip ic

The A393F New Original Chip IC is a high-performance integrated circuit designed for diverse electronic applications. Its modular architecture and industry-standard compliance ensure seamless integration into systems requiring reliability and efficiency.

Technical specifications

FeatureSpecificationApplication Scenario
Package TypeBGA (Ball Grid Array)High-density PCB assemblies
MaterialSolder balls (Sn/Pb-free)RoHS-compliant electronics
Thermal Resistance0.5°C/WPower-sensitive devices
Signal Integrity10 GHz bandwidthHigh-speed data transmission systems
Operating Temp.-40°C to +125°CIndustrial and automotive environments

Customization guide

Adjustable parameters include lead count, ball pitch, and thermal pad design to meet specialized requirements such as miniaturization, thermal management, or high-frequency signal needs.

Get inspired

With the A393F’s compact BGA design, you can optimize space in wearable devices while maintaining robust performance. Its low thermal resistance ensures stable operation in high-power applications like server cooling systems.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Thermal Resistance0.5°C/W0.43°C/W (+15%)0.35°C/W (+30%)
Signal Speed8 GHz10 GHz12 GHz
Power Handling5W6W (+20%)8W (+60%)

Supplier's note

  1. Three Breakthroughs:

    • BGA Packaging: Enables 40% higher component density than QFN, reducing PCB footprint.
    • Thermal Efficiency: The Pro model’s 0.35°C/W thermal resistance outperforms industry benchmarks by 30%, ideal for power amplifiers.
    • Signal Integrity: 12 GHz bandwidth in the Pro model ensures minimal latency in 5G communication systems.

  2. Version Selection Guidance:

    • Base Model: Suitable for cost-sensitive IoT devices requiring basic thermal and signal performance.
    • Advanced Model: Optimized for mid-range industrial controls needing 10 GHz signal speed and moderate power handling.
    • Pro Model: Best for high-end applications like data centers or aerospace systems, where extreme thermal and signal performance are critical.

With the Pro model’s 12 GHz bandwidth, you can achieve real-time data processing in edge computing setups. Its thermal efficiency also ensures safe operation in automotive ECUs exposed to extreme temperatures. Pairing the Advanced Model with its 6W power rating enables reliable use in robotics control systems.

Frequently asked questions

  • Which package type (BGA vs QFN) is best for high-density electronics applications using the A393F IC?

  • Is the A393F IC RoHS-compliant and certified for industrial use?

  • How does the thermal performance of QFN compare to TQFP in the A393F IC packaging?

  • What are the recommended storage conditions for the A393F IC to prevent oxidation?

  • What applications is the A393F IC designed for, and which package suits high-speed digital circuits?

  • Does the A393F IC support high-frequency operations in compact designs?

  • Which package (SOP vs TSOP) is better for space-constrained PCB layouts with the A393F IC?

  • Can the A393F IC be customized with non-standard packaging for specific applications?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
BGA (Ball Grid Array)High-performance computing, GPUs, FPGAsHigh pin count (up to 500 pins) ▲
Thermal resistance: 0.3°C/W (JEDEC JESD51-7)
No leads for reduced EMI		▲ Industry-leading density
Excellent thermal performance
High reliability		Complex rework process
Expensive PCB design requirements
QFN (Quad Flat No-Lead)High-speed digital circuits, IoT devicesNo leads + exposed thermal pad ▲
Thermal resistance: 0.4°C/W (ISO 9001)
Footprint: 30% smaller than TQFP		▲ Compact form factor
Improved thermal dissipation vs TQFP
Easy soldering		Sensitive to soldering temperatures
Limited pin count (20-48 pins)
TQFP (Thin Quad Flat Package)Microcontrollers, DSPs, space-constrained boardsThin profile (1.0mm height) ▲
Pin count: 44–200 pins (IEC 61187)		▲ Balanced density and reworkability
Cost-effective for mid-range apps		Higher thermal resistance (0.5°C/W) vs QFN/BGA
Leads prone to damage
TSOP (Thin Small Outline Package)Memory modules, RF circuitsUltra-low profile (0.8mm) ▲
Pin count: 20–100 pins (IPC-7351)		▲ Ultra-compact design
Lightweight for portable devices		Fragile gull-wing leads
Limited power handling capability
PLCC (Plastic Leaded Chip Carrier)Consumer electronics, automotive sensorsLeadframe-based ▲
Pin count: 20–44 pins (MIL-STD-883)		▲ Easy manual handling
Robust mechanical design		Bulky compared to QFN/BGA
Higher profile (2.0mm)
SOP (Small Outline Package)General-purpose ICs, low-power circuitsStandard profile (1.45mm) ▲
Pin count: 8–44 pins (JEDEC MO-153)		▲ Universal compatibility
Low cost
Easy to handle		Lower density than TSOP/QFN
Higher thermal resistance (0.6°C/W)

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