Package Type | PCB assembly requiring compact size | Industry Standard: QFN (4x4mm) Our Base: SOP16 (5x6mm) Our Advanced: Enhanced SOP16 (5x6mm, thermal pad) | Base: Easier handling during SMT assembly (▲ vs QFN) Advanced: 30% better heat dissipation (▲ vs Base) | Base: 25% larger footprint than QFN Advanced: 10% higher cost (▲ vs Base) |
Operating Temperature | Industrial/automotive applications | Industry Standard: -40°C to 85°C Our Base: -40°C to 85°C Our Advanced: -55°C to 125°C | Advanced: Operates in extreme environments (▲ vs Base/Industry) Base: Meets consumer-grade standards | Advanced: Requires costly moisture-resistant packaging (▲ vs Base) |
Power Consumption | Battery-operated devices | Industry Standard: 100mW Our Base: 90mW Our Advanced: 80mW (ISO 17353 compliant) | Advanced: 20% longer battery life (▲ vs Base) Base: 10% lower power than industry (▲ vs Standard) | Advanced: Slightly reduced peak performance (▲ vs Base) |
Operating Frequency | High-speed computing systems | Industry Standard: 100MHz Our Base: 120MHz Our Advanced: 150MHz (JEDEC JESD99-10 compliant) | Advanced: 50% faster processing (▲ vs Base) Base: 20% faster than industry (▲ vs Standard) | Advanced: 15% higher power draw (▲ vs Base) |
Moisture Resistance | Humid environments (e.g., marine systems) | Industry Standard: JESD22-A110 (48hr/85°C/85%RH) Our Base: JESD22-A110 (48hr) Our Advanced: 96hr exposure (▲ vs Base) | Advanced: Twice the reliability in humid conditions (▲ vs Base/Standard) | Advanced: Longer pre-bake time before soldering (▲ vs Base) |
Thermal Conductivity | High-power applications | Industry Standard: 1.5 W/m·K Our Base: 2.0 W/m·K Our Advanced: 3.0 W/m·K (ASTM E1461) | Advanced: 50% better heat dissipation (▲ vs Base) Base: 33% improvement over industry (▲ vs Standard) | Advanced: Requires specialized cooling solutions (▲ vs Base) |