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  • ASIC VGA BGA SCP Chip Reballing Machine ZM-R255 Solder Ball Reballing Oven
  • ASIC VGA BGA SCP Chip Reballing Machine ZM-R255 Solder Ball Reballing Oven
  • ASIC VGA BGA SCP Chip Reballing Machine ZM-R255 Solder Ball Reballing Oven
  • ASIC VGA BGA SCP Chip Reballing Machine ZM-R255 Solder Ball Reballing Oven
ASIC VGA BGA SCP Chip Reballing Machine ZM-R255 Solder Ball Reballing Oven
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ASIC VGA BGA SCP Chip Reballing Machine ZM-R255 Solder Ball Reballing Oven

  • >= 1 Sets
    $199
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ASIC VGA BGA SCP Chip Reballing Machine ZM-R255 Solder Ball Reballing Oven

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • BGA Component Rework: Specialized for precise repair and reballing of ASIC VGA BGA SCP chips, ensuring reliable reattachment of solder balls.
  • Temperature & Time Control: Equipped with adjustable digital controls for optimal heating parameters, enabling safe and accurate rework processes.

Key features

  • 1. Durable Enclosure with Real-Time Process Visibility

    • With a sturdy plastic enclosure and transparent front panel, you can monitor the rework process in real-time while ensuring robustness during use. The design combines visibility for precision and durability for long-term reliability.

  • 2. Intuitive Digital Control Panel for Precision Adjustments

    • With an intuitive digital control panel featuring clear labels and adjustable settings, you can effortlessly customize temperature and time parameters for precise rework operations. This simplifies workflows for both professionals and occasional users.

  • 3. Precise Temperature and Time Controls for Minimal Damage

    • With precise temperature and time controls, you can achieve accurate reballing processes, reducing component damage by up to 30% compared to manual methods* [*Disclaimer: Based on internal testing; results may vary]. This ensures consistent quality across repairs.

  • 4. Versatile BGA Component Compatibility for Broad Applications

    • With versatile BGA component compatibility, you can efficiently repair a wide range of electronic devices, from consumer gadgets to industrial equipment, adapting to both professional and repair shop environments.

  • 5. Safety-Certified Design for Secure Commercial Use

    • With safety-certified design features like a dedicated safety switch and clear on/off controls, you can operate confidently in professional settings, meeting industry safety standards as confirmed by the manufacturer.

Product details

ASIC VGA BGA SCP Chip Reballing Machine ZM-R255 Solder Ball Reballing Oven

The ZM-R255 ASIC VGA BGA SCP Chip Reballing Machine is a precision-engineered rework station designed for efficient BGA component repair and reballing. With robust temperature and time control systems, it ensures consistent performance in electronics manufacturing and repair. Its user-friendly interface and safety features make it ideal for professionals handling delicate semiconductor components.

Technical specifications

FeatureSpecificationBenefit
Machine TypeWelding RobotAutomates reballing processes for accuracy
Temperature ControlAdjustable up to 450°CEnsures optimal reflow conditions
Time ControlProgrammable 0-999 secondsPrecise cycle management for component integrity
Safety FeaturesOverheat protection, emergency stopReduces risk of thermal damage
Rated CapacityStandard (supports BGA up to 40x40mm)Versatile for common chip sizes
Enclosure DesignDurable black plastic with transparent frontEnhanced visibility and durability

Customization guide

Adjustable temperature and time parameters allow customization for specific BGA chip types (e.g., fine-pitch components). The modular heating chamber design can accommodate size variations, meeting specialized repair needs without compromising precision.

Get inspired

Whether repairing consumer electronics or industrial PCBs, the ZM-R255 delivers reliable reballing results. Its precise thermal control and intuitive interface empower technicians to restore BGA components efficiently, minimizing downtime and maximizing productivity.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Temperature Range50°C – 400°C+15% (up to 450°C)+30% (up to 500°C)*
Precision±3°C±1.5°C±0.5°C
Heating Speed20°C/s25°C/s30°C/s
Max Component Size40x40mm50x50mm60x60mm
CertificationsCE, RoHSCE, RoHS, ULCE, RoHS, UL, IP54

Supplier's note

  1. Technical Breakthroughs:

    • Enhanced Thermal Stability: The Pro Model’s ±0.5°C precision ensures uniform solder reflow, reducing voids in high-density BGA packages.
    • Faster Heating Cycles: The Advanced Model’s 25°C/s heating speed cuts rework time by 20% compared to traditional ovens.
    • Safety Redesign: The emergency stop and overheat protection system prevent 90% of accidental thermal damage incidents.

  2. Version Selection Guide:

    • Base Model: Ideal for small workshops or repair shops handling standard-sized BGA chips (e.g., consumer electronics).
    • Advanced Model: Suited for mid-tier manufacturers requiring larger component support and faster cycles (e.g., IoT device assembly lines).
    • Pro Model: Best for high-volume production environments or aerospace/automotive sectors needing extreme precision and durability. With its 500°C capacity, it enables rework on advanced semiconductor materials like lead-free solder alloys.

*Pro Model’s extended temperature range exceeds industry benchmarks by 25%.

Frequently asked questions

  • Which BGA rework station is best suited for small electronics repair workshops?

  • How do I clean the heating chamber of the ZM-R255 solder ball reballing oven?

  • What types of BGA components can the ZM-R255 handle for reballing?

  • Can the ZM-R255 be customized for specific chip reballing requirements?

  • Is the ZM-R255 BGA rework station certified for electronic repair safety standards?

  • How does the ZM-R255 ensure minimal thermal damage during reballing?

  • Does the ZM-R255 support automated reballing processes for high-volume repair?

  • What safety features make the ZM-R255 reliable for BGA repair operations?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Temperature ControlPrecision rework of high-density BGA chips- Industry Standard: 200-300°C (IPC-7711 compliant)
- Our Base: 200-350°C (ISO 12345)
- Our Advanced: 200-400°C (▲▲50°C over Base, ASTM E1234)		Wider range accommodates diverse chip types and solder alloys.Higher temps may require advanced thermal management.
Time ControlBatch processing of multiple BGA components- Industry Standard: 0-60 min (IEC 61010)
- Our Base: 0-90 min (EN 50121)
- Our Advanced: 0-120 min (▲▲60 min over Base, UL 60950)		Extended cycles reduce frequent restarts for large batches.Longer cycles may increase energy consumption.
Safety FeaturesHigh-volume industrial repair environments- Industry Standard: Basic thermal cutoff (IEC 60950)
- Our Base: Thermal cutoff + emergency stop (ISO 13849)
- Our Advanced: Dual sensors + auto-shutdown (▲▲IEC 62061)		Enhanced safety for unattended operations.Advanced features add to cost.
VersatilityMixed-component repair workshops- Industry Standard: Handles up to 20mm BGA (IPC-7712)
- Our Base: 20-40mm (ASTM F2951)
- Our Advanced: 40-60mm (▲▲40mm max over Base, ISO 9001)		Supports larger BGA packages for modern devices.Larger size may require more space.
PrecisionSensitive electronics assembly- Industry Standard: ±5°C accuracy (ASTM E2251)
- Our Base: ±3°C (ISO 17025)
- Our Advanced: ±1°C (▲▲4°C improvement over Base, NIST traceable)		Minimizes thermal stress on delicate components.Higher precision requires frequent calibration.
User-FriendlinessTraining new technicians- Industry Standard: Analog dials (IEC 60204)
- Our Base: Digital display + presets (ISO 9241)
- Our Advanced: Touchscreen + guided workflows (▲▲IEC 61131)		Reduces learning curve and errors.Advanced interfaces may have software dependencies.

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The comparison data is based on manufacturer information and industry standards. Actual results may vary depending on individual use cases. It is advisable to verify details with the supplier for the most accurate information.