Microcontroller Unit (MCU) | Embedded systems, IoT devices, automotive control | - Pin Count: 44 (Industry: 40 ▲10% - Operating Temp: -40°C to +85°C (IEC 60721-3-2) - Power: 0.5W (Advanced ▲20% lower than Base) | - Compact size (15x15mm) - Low power (Advanced ▲20% improvement) | - Limited reprogrammability vs FPGA - No real-time signal processing |
Field-Programmable Gate Array (FPGA) | Prototyping, signal processing, high-performance computing | - Reconfigurable Logic: 144 I/O pins (Industry: 120 ▲20% in Advanced) - Speed: 500MHz (Advanced ▲30% faster than Base) | - Flexible design updates - High-speed processing (Advanced ▲30%) | - Higher power consumption (2W Advanced vs 2.5W Base) - Complex setup |
System on Chip (SoC) | Smartphones, tablets, wearables | - Integrated CPU/GPU: 2.4GHz (Industry: 2GHz ▲20% in Advanced) - Memory: 8GB RAM (Base) ▲16GB (Advanced) | - All-in-one solution - High integration ▲ scalability (Advanced RAM) | - Limited customization - Higher cost vs standalone MCUs/FPGAs |
Digital Signal Processor (DSP) | Audio/video processing, radar systems | - Sampling Rate: 192kHz (Industry: 160kHz ▲20% in Advanced) - Latency: 0.1ms (Base) ▲0.05ms (Advanced) | - Real-time signal processing ▲50% latency reduction in Advanced | - Specialized use cases only - Higher power draw vs MCUs |
Application-Specific IC (ASIC) | Cryptocurrency mining, GPUs | - Throughput: 100 GH/s (Industry: 80 GH/s ▲25% in Advanced) - Power Efficiency: 0.2J/GH (Advanced ▲30% better) | - Optimized performance for specific tasks - Low power (Advanced ▲30%) | - Non-reconfigurable - High development costs |
Programmable Logic Controller (PLC) | Industrial automation, manufacturing | - I/O Channels: 64 (Industry: 48 ▲33% in Advanced) - Safety Cert: IEC 61508 SIL 3 (Advanced) | - Robust industrial-grade design - Advanced: SIL 3 safety compliance | - Bulky form factor vs SMD components - Limited scalability |