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  • Android development board with 3G 4G LET SIM card slot RK3568 4-core CPU SDK provided motherboard
  • Android development board with 3G 4G LET SIM card slot RK3568 4-core CPU SDK provided motherboard
  • Android development board with 3G 4G LET SIM card slot RK3568 4-core CPU SDK provided motherboard
  • Android development board with 3G 4G LET SIM card slot RK3568 4-core CPU SDK provided motherboard
  • Android development board with 3G 4G LET SIM card slot RK3568 4-core CPU SDK provided motherboard
  • Android development board with 3G 4G LET SIM card slot RK3568 4-core CPU SDK provided motherboard
Android development board with 3G 4G LET SIM card slot RK3568 4-core CPU SDK provided motherboard
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Android development board with 3G 4G LET SIM card slot RK3568 4-core CPU SDK provided motherboard

  • 10 - 99 Pieces
    $77
  • 100 - 999 Pieces
    $72
  • 1000 - 4999 Pieces
    $67
  • >= 5000 Pieces
    $62

Customization:

Customized logo（Min.Order: 100 pieces）
Customized packaging（Min.Order: 500 pieces）
Graphic customization（Min.Order: 500 pieces）
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Android development board with 3G 4G LET SIM card slot RK3568 4-core CPU SDK provided motherboard

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Android Development Platform: Equipped with a Rockchip RK3568 4-core CPU (2.0GHz) and Android OS support, enabling the development of IoT applications, smart devices, and embedded systems.
  • Cellular Connectivity: Integrated 3G/4G LTE SIM card slot for seamless network connectivity in remote or mobile deployments.
  • Versatile I/O: Supports USB, Ethernet, HDMI/DisplayPort, and jumper headers for customizable configurations, ideal for prototyping and hardware integration.
  • SDK Integration: Provides comprehensive software development kits (SDKs) for streamlined application development and debugging.

Key features

  • 1. Material Technology: Durable FR4 Construction with Enhanced Thermal Management

    • With an FR4-based PCB and an integrated heatsink, ensure reliable operation under high workloads while maintaining structural integrity. This design outperforms standard boards prone to overheating in intensive applications*.

  • 2. Interactive Design: Versatile Connectivity and Developer-Friendly SDK

    • With multiple interfaces (USB, Ethernet, HDMI/DisplayPort) and a pre-provided SDK, streamline development and integration into IoT, robotics, or embedded systems. Customize configurations via jumper headers for tailored solutions*.

  • 3. Performance Parameters: High-Performance RK3568 CPU for Demanding Tasks

    • With a 4-core 2.0GHz RK3568 processor and dedicated memory, achieve fast processing speeds for AI, multimedia, or real-time data applications—ideal for scenarios requiring rapid computation*.

  • 4. Scenario Solutions: Built-in 3G/4G LTE Support for Flexible Deployment

    • With a SIM card slot for cellular connectivity, deploy in remote or mobile environments where wired solutions are impractical. The power management chip ensures efficient energy use for portable or power-sensitive projects*.

  • 5. Certification Standards: Compliance with European Environmental Regulations

    • With EPR certifications for France and Germany, meet strict environmental and packaging standards in key European markets, reducing compliance risks for distributors and manufacturers*.

Product details

Android development board with 3G 4G LET SIM card slot RK3568 4-core CPU SDK provided motherboard

The Android development board with 3G/4G LTE SIM slot and RK3568 4-core CPU is designed for versatile embedded system applications. Built with FR4 material for durability and equipped with advanced connectivity options, it supports high-performance tasks like AI processing, IoT solutions, and robotics.

Technical specifications

FeatureSpecificationBenefit
CPU2.0GHz RK3568 4-core processorDelivers robust performance for complex tasks
Connectivity3G/4G LTE SIM slot + USB/Ethernet portsEnables seamless cellular and wired data transmission
MaterialFR4 PCBEnsures durability and stable electrical performance
ComplianceEPR_France_Packing, EPR_Germany_PackingMeets strict environmental regulations for EU markets
Memory2GB DDR4 RAM + 16GB eMMC storageSupports multi-tasking and data-intensive applications
CoolingIntegrated heatsinkMaintains optimal performance under heavy loads

Customization guide

Adjust jumper headers to configure I/O pin functions, enabling customization for specific applications like industrial control systems or wearable devices. The heatsink design allows for thermal management optimization based on workload requirements.

Get inspired

With its 3G/4G LTE SIM slot and powerful RK3568 CPU, this board is ideal for building smart IoT devices, automated robotics, or edge computing systems. The modular design ensures adaptability for both prototyping and production environments.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
CPU Speed2.0GHz2.2GHz (+10%)2.4GHz (+20%)
Connectivity3G/4G LTE3G/4G LTE + Wi-Fi 63G/4G LTE + Wi-Fi 6 + Bluetooth 5.2
Memory2GB RAM/16GB eMMC4GB RAM/32GB eMMC8GB RAM/64GB eMMC
Thermal DesignStandard heatsinkEnhanced heatsinkActive cooling fan

Supplier's note

  1. Technical Breakthroughs:

    • EPR Compliance: Dual EPR certifications ensure environmental sustainability, reducing regulatory barriers in EU markets.
    • 4G LTE Integration: The SIM slot enables real-time data transmission for IoT and remote monitoring applications.
    • RK3568 Performance: The 2.0GHz CPU delivers 20% faster processing than older generation boards, ideal for AI workloads.

  2. Version Selection Guide:

    • Base Model: Suitable for basic IoT devices or educational projects requiring cost-effective performance.
    • Advanced Model: Recommended for robotics and industrial automation needing enhanced connectivity and memory.
    • Pro Model: Best for high-end applications like edge AI servers or 24/7 operation systems requiring active cooling and premium specs.

With the Pro version’s 2.4GHz CPU and active cooling, you can sustain intensive tasks like real-time video processing. Pair its 8GB RAM with the 64GB eMMC for large-scale data storage, making it ideal for smart city infrastructure or autonomous systems.

Frequently asked questions

  • Which Android development board model is best for IoT applications requiring 4G connectivity?

  • How do I maintain the heatsink on the RK3568 development board?

  • Is the RK3568 motherboard EPR-compliant for EU packing requirements?

  • Can I customize the board’s configuration using jumper headers?

  • Does the RK3568 CPU support high-performance tasks like AI processing?

  • What development tools are included with the RK3568 motherboard?

  • Does the board support 3G/4G LTE for remote IoT deployments?

  • How does the power management chip enhance efficiency?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Cellular ConnectivityMobile field devices, IoT deploymentsIndustry: Wi-Fi only; Our Base: 3G/4G LTE SIM slot; Our Advanced: 5G ▲2x faster data rates (up to 1 Gbps)Enables cellular connectivity in remote areas; supports IoT scalabilityHigher cost for 5G module; requires SIM card subscription
CPU PerformanceAI/ML workloads, roboticsIndustry: 1.8GHz CPU; Our Base: 2.0GHz RK3568 ▲11% faster; Advanced: 2.2GHz ▲22% faster (Benchmark: Geekbench 1500)Handles complex tasks like real-time analytics; supports multi-threadingIncreased heat output; needs active cooling for Advanced tier
Environmental ComplianceEU market entryIndustry: Basic RoHS; Our Base/Advanced: EPR France/Germany Packaging ▲Full compliance with EU Waste Directive 2002/96/ECStreamlines EU regulatory approvals; reduces environmental liabilityCertification costs may increase BOM by ~5-8%
Customization OptionsPrototyping, embedded systemsIndustry: Fixed configurations; Our Base/Advanced: 20+ jumper headers ▲Full pinout access for hardware hackingAdaptable to custom interfaces; supports rapid prototypingRequires advanced soldering skills for header modifications
Power EfficiencyBattery-powered devicesIndustry: Basic voltage regulators; Our Base: Dedicated PMIC ▲20% lower idle power (0.8W vs 1.0W); Advanced: 30% lower (0.7W)Extends battery life in drones/sensors; reduces heat generationAdds complexity to power circuit design
Thermal ManagementHigh-load industrial applicationsIndustry: Passive cooling; Our Base: Heatsink ▲40°C lower CPU temp; Advanced: Active fan ▲60°C reduction (ISO 7745)Maintains stable performance in factories; prevents thermal throttlingLarger form factor; increases maintenance requirements

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