Material & Flame Resistance | Industrial appliances, high-heat environments | Industry Standard: UL 94 V-2 rated FR4 (1.6 mm thickness) Our Base: UL 94 V-0 rated ATX 94V0 FR4 (1.6 mm) Our Advanced: UL 94 V-0 + 10% enhanced thermal stability (1.8 mm) | ▲ Advanced: Withstands 20% higher thermal stress (per ASTM E1461) | ▲ Advanced: 15% heavier than Base (due to thicker substrate) |
Signal Integrity | High-speed data systems (e.g., smart appliances) | Industry Standard: 100 MHz impedance control Our Base: 150 MHz ±10% Our Advanced: 200 MHz ±5% (with impedance profiling) | ▲ Advanced: 2x lower signal loss in IoT devices (per IEC 61130) | ▲ Advanced: 30% higher cost due to precision etching |
Thermal Management | High-power appliances (e.g., coffee makers) | Industry Standard: 1.4 W/mK thermal conductivity Our Base: 1.6 W/mK (ISO 22007-2) Our Advanced: 2.0 W/mK + embedded cooling vias | ▲ Advanced: 25% faster heat dissipation (per ASTM D5470) | ▲ Advanced: Requires larger chassis for cooling vias |
Connector Density | Modular appliances (e.g., smart kitchens) | Industry Standard: 20 connectors/board Our Base: 30 connectors (IEC 60207) Our Advanced: 40 connectors + hybrid mounting ▲ | ▲ Advanced: 70% more I/O flexibility for multi-device integration | ▲ Advanced: 20% higher assembly complexity |
Customization | Bespoke home appliances (e.g., BUNN-O-MATIC machines) | Industry Standard: Limited to standard component layouts Our Base: 50+ customizable footprints Our Advanced: Full hybrid design (SMD + through-hole) ▲ | ▲ Advanced: 40% faster prototyping (per IPC-2221) | ▲ Advanced: Requires specialized assembly tools |
EMI Noise Reduction | Noise-sensitive environments (e.g., hospitals) | Industry Standard: 45 dBA (C-weighted) Our Base: 40 dBA (IEC 61130) Our Advanced: 35 dBA + shielded layers ▲ | ▲ Advanced: Quieter than a whisper (35 dBA vs. 45 dBA industry) | ▲ Advanced: Adds 10% to board area for shielding |