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  • Automatic Laptop Computer Mobile Phone Manufacturing Equipment Bga Ic Chip Level Repair Machine
  • Automatic Laptop Computer Mobile Phone Manufacturing Equipment Bga Ic Chip Level Repair Machine
  • Automatic Laptop Computer Mobile Phone Manufacturing Equipment Bga Ic Chip Level Repair Machine
  • Automatic Laptop Computer Mobile Phone Manufacturing Equipment Bga Ic Chip Level Repair Machine
  • Automatic Laptop Computer Mobile Phone Manufacturing Equipment Bga Ic Chip Level Repair Machine
  • Automatic Laptop Computer Mobile Phone Manufacturing Equipment Bga Ic Chip Level Repair Machine
Automatic Laptop Computer Mobile Phone Manufacturing Equipment Bga Ic Chip Level Repair Machine

Automatic Laptop Computer Mobile Phone Manufacturing Equipment Bga Ic Chip Level Repair Machine

  • >= 1 Pieces
    $6,500
View product details

Automatic Laptop Computer Mobile Phone Manufacturing Equipment Bga Ic Chip Level Repair Machine

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Chip Level Repair: Designed for precision BGA IC chip level repair, this machine is essential in the manufacturing and maintenance of electronic devices.
  • Automated Operation: Streamlines the repair process of mobile phones and laptops, enhancing efficiency and reducing manual labor.

Key features

  • 1. Advanced Material Technology

    • With its corrosion-resistant metal body, this repair machine ensures long-lasting durability even in demanding manufacturing environments.

  • 2. Interactive Design

    • Featuring a user-friendly touchscreen interface, this equipment allows for precise control and ease of operation during complex repair tasks.

  • 3. Superior Performance Parameters

    • With its high output speed, the machine provides efficient chip-level repairs, making it ideal for rapid manufacturing processes.

  • 4. Versatile Scenario Solutions

    • Designed for both mobile phone and laptop repairs, this machine adapts seamlessly to various electronic manufacturing needs, ensuring flexibility in production lines.

  • 5. Adherence to Certification Standards

    • Engineered with eco-friendly certification, this machine supports sustainable manufacturing practices, reducing environmental impact.

Product details

Automatic Laptop Computer Mobile Phone Manufacturing Equipment Bga Ic Chip Level Repair Machine

Experience precision and efficiency with our Automatic Laptop Computer Mobile Phone Manufacturing Equipment, designed specifically for BGA IC chip-level repair. This versatile machine is ideal for mobile phone manufacturing and repair needs.

Technical specifications

FeatureSpecificationBenefit
MaterialHigh-grade SteelDurability and longevity
SizeCompact DesignSpace-saving and easy placement
Power Supply220V/50HzStandard compatibility
Temperature Range100°C - 400°CVersatile for various materials

Customization guide

Adjustable temperature settings to meet specific repair requirements, ensuring compatibility with different chip sizes and materials.

Get inspired

With our BGA IC repair machine, streamline your mobile phone manufacturing process and achieve unparalleled repair precision. Ideal for tech repair shops and manufacturing units looking to enhance productivity.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Temperature Range100°C - 350°C100°C - 375°C100°C - 400°C
Power EfficiencyStandard+15%+30%*

Supplier's note

  1. The Pro version's enhanced temperature precision, a significant breakthrough, allows for safe and accurate repairs, even for the most delicate components. When paired with its compact design, users benefit from a space-efficient yet powerful tool.
  2. For general repair needs, the Base Model suffices. However, the Advanced Model offers a balance of enhanced features for more demanding tasks, whereas the Pro Model is optimal for professional environments requiring maximum precision and efficiency.

Frequently asked questions

  • Which BGA IC repair machine model suits small electronics repair shops?

  • How do I maintain and care for the BGA IC repair machine for optimal performance?

  • What is the difference between using this BGA IC repair machine and traditional soldering methods?

  • Can I get custom settings for different chip types with this BGA IC repair machine?

  • Is the BGA IC repair machine suitable for repairing laptops and mobile phones?

  • How does the BGA IC repair machine enhance the efficiency of mobile phone manufacturing equipment?

  • Are there any recommended cleaning solutions for the BGA IC repair machine?

  • Is the material used in the BGA IC repair machine FDA-approved for safety?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
BGA IC Repair MachineMobile phone repair workshopsPrecision alignment (±0.01 mm accuracy)High repair success rateRequires skilled operator
Temperature control (±2°C precision)Reduces risk of overheating componentsHigh initial cost
Automatic Laptop RepairLaptop service centersAutomated process (minimizes manual intervention)Speeds up repair timeLimited to certain models
Multi-device compatibility (supports 15+ brands)Versatility in repair optionsComplex setup process
Mobile Phone ManufacturingLarge-scale production facilitiesHigh throughput (up to 300 units/hour)Increases productivitySpace-intensive equipment
Advanced soldering technology (lead-free)Environmentally friendlyHigh energy consumption
Chip Level RepairElectronics repair shopsMicro-soldering capability (0.1 mm components)Allows for detailed and precise repairsRequires specialized training
Verification system (integrated quality checks)Ensures repair reliabilityTime-consuming for complex repairs
Other Welding EquipmentGeneral electronics maintenanceVersatile usage (suitable for various materials)Broad application rangeMay lack specialization for specific tasks
Portable design (lightweight, 5 kg)Easy to transportLimited power output

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