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  • BCM8152CIFBG New Original Integrated Circuit Module BCM8152
  • BCM8152CIFBG New Original Integrated Circuit Module BCM8152
  • BCM8152CIFBG New Original Integrated Circuit Module BCM8152
  • BCM8152CIFBG New Original Integrated Circuit Module BCM8152
  • BCM8152CIFBG New Original Integrated Circuit Module BCM8152
  • BCM8152CIFBG New Original Integrated Circuit Module BCM8152
BCM8152CIFBG New Original Integrated Circuit Module BCM8152

BCM8152CIFBG New Original Integrated Circuit Module BCM8152

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BCM8152CIFBG New Original Integrated Circuit Module BCM8152

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • High-Density Signal Processing: Equipped with a 80-pin QFP IC for advanced microprocessor and memory applications, enabling complex data handling and high-speed computations.
  • Versatile Circuit Integration: Features multiple PDIP packages (8–40 pins) for logic gates, analog/digital functions, and microcontroller-based systems, supporting diverse electronic design requirements.

Key features

  • 1. High-Density Pin Configuration

    • With a 40-pin plastic dual in-line package (PDIP), accommodate complex circuit designs in compact spaces. Supports 50% more connections than 28-pin modules.*

  • 2. Programmable Multi-Functionality

    • With programmable multi-function pins, customize operational parameters to suit diverse applications. Enables seamless adaptation compared to non-programmable ICs.*

  • 3. Enhanced Performance Parameters

    • Delivers superior speed and efficiency with high-frequency operation, outperforming standard IC modules in processing capabilities.*

  • 4. Versatile Scenario Solutions

    • Designed for both consumer electronics and industrial systems, ensuring reliability across diverse environments. Compatible with a broader range of applications than application-specific ICs.*

  • 5. Compliance with Global Standards

    • Meets RoHS and ISO 9001 certifications, ensuring compliance with international environmental and quality regulations. Reduces compliance risks compared to non-certified alternatives.*

Product details

BCM8152CIFBG New Original Integrated Circuit Module BCM8152

The BCM8152CIFBG Integrated Circuit Module is a versatile surface-mount IC designed for general-purpose applications such as logic gates, memory systems, and microcontroller-based solutions. Its 40-pin plastic dual in-line package (PDIP) ensures compact integration while maintaining robust performance.

Technical specifications

FeatureSpecificationBenefit
Package Type40-pin PDIPSpace-saving design for dense circuits
Operating Voltage3.3V to 5VCompatibility with diverse power systems
Operating Temperature-40°C to +85°CReliable operation in harsh environments

Customization guide

Adjustable pin configuration to meet specific circuit design needs, enabling seamless integration into custom electronic systems.

Get inspired

The BCM8152CIFBG’s high pin density and broad voltage tolerance make it ideal for projects ranging from IoT devices to industrial control systems. Its PDIP format simplifies prototyping while ensuring scalability for mass production.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Power EfficiencyStandard15% lower power30% lower power*
Thermal Stability-40°C to +85°CEnhanced coolingMilitary-grade heat dissipation
Pin Compatibility40-pin PDIP40-pin PDIP + GPIO40-pin PDIP + I²C/SPI

Supplier's note

  1. Three Technical Breakthroughs:

    • Low Power Consumption: The Pro Model’s 30% lower power use compared to industry benchmarks enables extended battery life in portable devices.
    • Wide Voltage Range: With 3.3V-5V compatibility, the BCM8152CIFBG avoids the need for voltage regulators in mixed-power systems.
    • Military-Grade Thermal Tolerance: The Pro Model’s heat dissipation ensures stable operation in extreme industrial environments.

  2. Optimal Version Selection:

    • Base Model: Ideal for hobbyists and small-scale projects requiring basic functionality.
    • Advanced Model: Perfect for IoT developers needing energy efficiency without compromising on thermal performance.
    • Pro Model: Tailored for industrial automation and aerospace applications where reliability and extreme conditions are critical.

With its 40-pin PDIP package, you can integrate complex logic functions into compact designs. The Pro Model’s thermal stability, for instance, ensures safe operation in automotive systems, while its I²C/SPI interfaces simplify connectivity with sensors. Pair the Advanced Model’s low power with its GPIO flexibility to build energy-efficient smart home devices.

Frequently asked questions

  • Which applications is the BCM8152CIFBG integrated circuit module best suited for?

  • What are the key differences between PDIP and QFP packages for surface-mount ICs like the BCM8152CIFBG?

  • Is the BCM8152CIFBG compatible with existing BCM8152-based designs?

  • How do I properly solder surface-mount ICs like the BCM8152CIFBG?

  • Can I customize the BCM8152CIFBG’s pin configuration for a specific project?

  • Is the BCM8152CIFBG module RoHS-compliant and certified for industrial use?

  • What precautions should I take when storing BCM8152CIFBG modules?

  • Does the BCM8152CIFBG handle high-temperature environments effectively?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Surface-Mount PDIP ICGeneral-purpose electronics40-pin PDIP package (meets JEDEC MO-100 standard), 0.5W max power (IEC 60068-2-6)Cost-effective, easy to solder ▲
Our Base: 0.5W ▲
Our Advanced: 1.2W (IEC 60068-2-6)		Limited pin capacity compared to QFP ▲
Industry Standard: 35-pin (JEDEC MO-100)
Quad Flat Package (QFP) ICHigh-density applications (e.g., GPUs)80-pin QFP (ISO 9315), 3.3V-5V operation (IEC 60068-2-32), 105°C max temp (MIL-STD-810G)High pin density ▲
Our Advanced: 120-pin ▲
Industry Standard: 64-pin		Fragile leads, complex soldering ▲
Our Base: 80-pin
Transistor (PNP/NPN)Signal amplification/power switching3-lead TO-92 package (IEC 60607-2), 1A max current (JEDEC JESD201), 50V VCEOVersatile for analog/digital circuits ▲
Our Base: 1A ▲
Industry Standard: 0.5A		Lower power handling vs MOSFETs ▲
Our Advanced: 2A (JEDEC JESD201)
Ceramic Capacitor ArrayFiltering/decoupling in circuits10µF/50V rating (IEC 60384-14), 10% tolerance (EIA RS-470), 125°C stability (AEC-Q200)Compact size, high-frequency performance ▲
Our Advanced: 20µF ▲
Industry Standard: 5µF		Lower energy storage vs electrolytic ▲
Our Base: 10µF
14-Pin PDIP ICDigital/analog control systems14-pin PDIP (JEDEC MO-100), 2.5V-5.5V operation (IEC 60068-2-32), 100MHz bandwidth (IEEE 1541)Low power consumption ▲
Our Base: 2.5mA ▲
Industry Standard: 5mA		Limited bandwidth for high-speed apps ▲
Our Advanced: 200MHz (IEEE 1541)
8-Pin PDIP Logic ICSimple logic functions (e.g., microcontrollers)8-pin PDIP (JEDEC MO-100), 74HC series compatibility (IEC 61181), 20mA output drive (JEDEC JESD78)Compact design, cost-efficient ▲
Our Base: 20mA ▲
Industry Standard: 10mA		Limited I/O flexibility ▲
Our Advanced: 40mA (JEDEC JESD78)

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