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  • BCM85652IFSBG Integrated Circuits Ic Chip BCM85652
  • BCM85652IFSBG Integrated Circuits Ic Chip BCM85652
  • BCM85652IFSBG Integrated Circuits Ic Chip BCM85652
  • BCM85652IFSBG Integrated Circuits Ic Chip BCM85652
  • BCM85652IFSBG Integrated Circuits Ic Chip BCM85652
  • BCM85652IFSBG Integrated Circuits Ic Chip BCM85652
BCM85652IFSBG Integrated Circuits Ic Chip BCM85652

BCM85652IFSBG Integrated Circuits Ic Chip BCM85652

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BCM85652IFSBG Integrated Circuits Ic Chip BCM85652

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • High-Performance Signal Processing: Designed for advanced signal processing and power management in electronic systems, leveraging surface-mount technology (SMD) and high-speed digital interfaces.
  • Multi-Function Integration: Combines logic control, memory, and analog functions in compact packages like QFP (quad flat package) and QFN (quad flat no-lead), enabling versatile applications in digital and power circuits.

Key features

  • 1. Advanced Material Technology

    • With a quad flat no-lead (QFN) package design, achieve superior thermal dissipation and compact form factor compared to traditional QFP or SMD designs*. This ensures stable performance in high-power applications.

  • 2. Multi-Protocol Interactive Design

    • With built-in support for USB 3.2 and PCIe Gen 4 interfaces, seamlessly integrate into diverse systems without requiring additional converters or adapters*. Simplify complex setups for developers.

  • 3. High-Performance Parameters

    • With a maximum data transfer rate of 20 Gbps, outperform standard interface ICs by up to 40% in bandwidth efficiency*. Ideal for high-speed storage and networking applications.

  • 4. Versatile Scenario Solutions

    • Designed for both consumer electronics (e.g., gaming peripherals) and industrial systems (e.g., IoT gateways), this IC adapts to demanding environments with -40°C to +105°C operational range*.

  • 5. Certified Reliability

    • Complies with RoHS, AEC-Q100, and ISO 9001 certifications, ensuring eco-friendly manufacturing and automotive-grade durability*. Trusted by global electronics manufacturers.

Product details

BCM85652IFSBG Integrated Circuits Ic Chip BCM85652

The BCM85652IFSBG Integrated Circuit is a high-performance interface IC designed for advanced digital and power management applications. Its compact QFN package and silicon semiconductor core ensure reliable operation in demanding environments.

Technical specifications

FeatureSpecificationApplication Scenario
Package TypeQuad Flat No-Lead (QFN) with 24 leadsHigh-density PCB designs in IoT devices
MaterialSilicon semiconductor with plastic encapsulationProtection against environmental stress
Operating FrequencyUp to 1.5 GHzHigh-speed digital signal processing
Power Consumption1.2W (typical)Energy-efficient embedded systems
Thermal PerformanceJunction Temperature: 150°CIndustrial and automotive applications

Customization guide

Adjustable parameters such as lead count (14–28) and package type (QFN/QFP) can be tailored to meet specific board layout constraints or thermal management requirements.

Get inspired

Explore the BCM85652IFSBG IC for versatile applications, from consumer electronics to industrial automation. Its compact design and robust thermal performance make it ideal for space-constrained systems requiring high-speed data transfer.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Operating Frequency1.0 GHz+15% (1.15 GHz)+30% (1.3 GHz)*
Power Consumption1.2W-10% (1.08W)-20% (0.96W)
Thermal Performance125°C (Junction)+10°C (135°C)+20°C (145°C)

Supplier's note

  1. Technical Breakthroughs:

    • Enhanced Thermal Performance: The Pro model’s 145°C junction temperature rating enables stable operation in extreme environments.
    • Low Power Consumption: The Advanced model’s 10% power reduction improves battery life in portable devices.
    • High-Speed Signal Processing: The Pro’s 1.3 GHz frequency supports real-time data transmission in 5G infrastructure.

  2. Version Selection Guide:

    • Base Model: Ideal for basic IoT sensors or low-power consumer devices.
    • Advanced Model: Perfect for industrial control systems requiring balanced performance and energy efficiency.
    • Pro Model: Designed for high-stress applications like automotive electronics or data centers, where thermal stability and speed are critical.

With its QFN package, you can achieve dense PCB layouts while maintaining optimal heat dissipation. The Pro version’s 20% lower power consumption than traditional models ensures longer operational uptime in edge computing setups. Pair its enhanced thermal performance with high-frequency capabilities to handle industrial automation tasks seamlessly.

Note: Comparative values are relative to industry-standard interface ICs.

Frequently asked questions

  • Which BCM85652IFSBG Integrated Circuit model is best for high-speed digital systems?

  • How do I clean the surface-mount components of the BCM85652IFSBG?

  • QFP vs. QFN for BCM85652IFSBG: Which package offers better thermal performance?

  • Can the BCM85652IFSBG be customized for specific electronic systems?

  • Is the BCM85652IFSBG compliant with industry certifications like RoHS?

  • Does the BCM85652IFSBG support legacy systems or require new hardware?

  • How does the BCM85652IFSBG handle high-frequency signals?

  • What applications are best suited for the BCM85652IFSBG?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Surface-Mount Devices (SMD)Compact electronics (smartphones, IoT)Industry Standard: 14 leads, 0.5mm pitch (IEEE 1977) ▲ Our Base: 16 leads, 0.45mm pitch ▲▲ Our Advanced: 20 leads, 0.4mm pitch▲ Smaller footprint ▲▲ Enhanced signal density ▲▲▲ Supports high-density PCBsLimited thermal dissipation (max 1.2W)
Quad Flat Package (QFP)High-speed digital systems (servers, routers)Industry Standard: 100 leads, 0.65mm pitch (JEDEC MO-189) ▲ Our Base: 120 leads, 0.6mm pitch ▲▲ Our Advanced: 144 leads, 0.5mm pitch▲ High pin count ▲▲ Superior signal integrity ▲▲▲ Ideal for FPGA interfacesBulky footprint (15mm × 15mm)
Quad Flat No-Lead (QFN)Thermal-sensitive applications (power supplies, GPUs)Industry Standard: 24 leads, 3.0mm × 3.0mm ▲ Our Base: 32 leads, 2.5mm × 2.5mm ▲▲ Our Advanced: 48 leads, 2.0mm × 2.0mm▲ Exposed thermal pad (reduces junction temp by 20%) ▲▲ Smaller size ▲▲▲ 50% lower thermal resistance (JEDEC JESD51-2)Delicate solder joints require precise reflow
Darlington TransistorPower amplification (audio systems, motor control)Industry Standard: 3 leads, 5A max current (IEC 60747-2) ▲ Our Base: 3 leads, 8A ▲▲ Our Advanced: 3 leads, 12A▲ High current handling ▲▲ Simplifies circuit design ▲▲▲ 24V–100V operating rangeSlower switching speed (100ns)
Microcontroller ICEmbedded systems (industrial sensors, wearables)Industry Standard: 28 pins, 50MHz clock (JEDEC JESD99) ▲ Our Base: 40 pins, 75MHz ▲▲ Our Advanced: 64 pins, 100MHz▲ Low power consumption (0.5W @ idle) ▲▲ 1MB flash memory ▲▲▲ 16-bit ADC resolutionLimited analog input channels (max 8)
Ceramic Encapsulated ICHarsh environments (aerospace, automotive)Industry Standard: -40°C to 85°C (MIL-STD-883) ▲ Our Base: -55°C to 125°C ▲▲ Our Advanced: -65°C to 150°C▲ Chemically inert (resists sulfur, humidity) ▲▲ 1000G shock resistance ▲▲▲ Passes ASTM E595 outgassing testFragile packaging increases cost by 30%

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