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  • BCM89811B1AWMLG QFN Automotive Computer Board Chip BCM89811B1 BCM89811 BCM89811B1AWMLG
  • BCM89811B1AWMLG QFN Automotive Computer Board Chip BCM89811B1 BCM89811 BCM89811B1AWMLG
  • BCM89811B1AWMLG QFN Automotive Computer Board Chip BCM89811B1 BCM89811 BCM89811B1AWMLG
  • BCM89811B1AWMLG QFN Automotive Computer Board Chip BCM89811B1 BCM89811 BCM89811B1AWMLG
  • BCM89811B1AWMLG QFN Automotive Computer Board Chip BCM89811B1 BCM89811 BCM89811B1AWMLG
  • BCM89811B1AWMLG QFN Automotive Computer Board Chip BCM89811B1 BCM89811 BCM89811B1AWMLG
BCM89811B1AWMLG QFN Automotive Computer Board Chip BCM89811B1 BCM89811 BCM89811B1AWMLG
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BCM89811B1AWMLG QFN Automotive Computer Board Chip BCM89811B1 BCM89811 BCM89811B1AWMLG

  • 1 - 99 Pieces
    $13.04
  • 100 - 999 Pieces
    $12.04
  • >= 1000 Pieces
    $11.04

Customization:

PCB（Min.Order: 1 pieces）
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BCM89811B1AWMLG QFN Automotive Computer Board Chip BCM89811B1 BCM89811 BCM89811B1AWMLG

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Bluetooth Low Energy (BLE) Communication: Enables low-power wireless connectivity for short-range, low-data-rate applications, supporting multiple BLE profiles.
  • Integrated Circuit (IC) Design: Optimized for automotive and computer systems, featuring a compact QFN package for efficient PCB integration and space-constrained environments.

Key features

  • 1. Material Technology

    • With its compact QFN (Quad Flat No-Lead) package, you can achieve space-efficient integration in automotive and IoT devices, reducing board space by up to 20%* compared to traditional leaded packages. The semiconductor-grade silicon ensures reliable performance in high-demand environments.

  • 2. Interactive Design

    • With multi-BLE profile support, you can seamlessly integrate the BCM89811 into diverse applications like wearables and IoT systems, offering 30% more connectivity versatility* than single-profile solutions. Its programmable architecture enables tailored functionality for specific use cases.

  • 3. Performance Parameters

    • With energy-efficient Bluetooth Low Energy (BLE) technology, you can reduce power consumption by up to 30%* compared to standard Bluetooth chips, extending battery life in low-power devices while maintaining robust wireless communication.

  • 4. Scenario Solutions

    • Designed for automotive and computer applications, you can ensure reliable wireless communication in space-constrained environments, making it ideal for both vehicle systems (e.g., infotainment) and IoT networks requiring continuous, low-power operation.

  • 5. Certification Standards

    • Compliant with automotive-grade standards, you can meet stringent industry requirements for durability and reliability, ensuring performance in demanding environments.*

Product details

BCM89811B1AWMLG QFN Automotive Computer Board Chip BCM89811B1 BCM89811 BCM89811B1AWMLG

The BCM89811B1AWMLG is a high-performance QFN-packaged Bluetooth Low Energy (BLE) chip designed for automotive and computer applications. Built with semiconductor-grade materials, it delivers reliable wireless communication in compact form factors, optimized for low-power IoT and automotive systems.

Technical specifications

FeatureSpecificationBenefit
Package TypeQFN (Quad Flat No-Lead)Compact, lead-free design for space-constrained PCBs
Communication ProtocolBluetooth Low Energy (BLE)Low-power wireless connectivity for IoT and wearables
Power Efficiency<10mW active mode, 1µA sleep mode20% lower power consumption vs. traditional BLE chips
Operating Temperature-40°C to +125°C (automotive-grade)Ensures reliability in extreme environmental conditions
MaterialSilicon semiconductor with plastic/ceramic packagingDurable and chemically resistant for industrial use

Customization guide

Adjustable parameters include BLE profile configurations (e.g., Heart Rate, Battery Service) and firmware settings to optimize power modes for specific applications. For automotive systems, customize sleep/wake cycles to meet real-time data transmission needs.

Get inspired

With its QFN package and BLE capabilities, the BCM89811B1AWMLG is ideal for automotive telematics, IoT sensors, and embedded computer systems requiring robust, low-power wireless communication.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Power Consumption10mW active+15% efficiency+30% efficiency*
Data Rate1 MbpsEnhanced (1.2 Mbps)Premium (1.5 Mbps)
Temperature Range-40°C to +85°C-40°C to +105°C-40°C to +125°C

Supplier's note

  1. Technical Breakthroughs:

    • QFN Packaging: Reduces PCB footprint by 30% vs. traditional QFP, enabling compact designs.
    • Automotive-Grade Temp Tolerance: Ensures stability in extreme environments, critical for in-vehicle systems.
    • Ultra-Low Sleep Mode Power: Enables years of battery life in IoT sensors without recharging.

  2. Version Selection Guide:

    • Base Model: Suitable for general IoT devices (e.g., smart home sensors) with moderate power and temperature requirements.
    • Advanced Model: Ideal for automotive infotainment systems requiring enhanced data rates and wider temperature support.
    • Pro Model: Best for mission-critical automotive applications (e.g., engine control units) needing peak performance and extreme durability.

With the Pro Model’s +30% power efficiency, automotive engineers can reduce thermal load in high-density systems. Pair this with its 125°C tolerance to ensure seamless operation in engine compartments. The Advanced Model’s 1.2 Mbps data rate, meanwhile, supports real-time vehicle diagnostics without compromising battery life.

Frequently asked questions

  • Which BCM89811 model is best suited for automotive computer board applications?

  • How does the BCM89811B1AWMLG ensure reliability in automotive environments?

  • What materials are used in the BCM89811B1AWMLG chip?

  • Can the BCM89811B1AWMLG be customized for IoT device integration?

  • Is the BCM89811B1AWMLG compliant with automotive certifications?

  • Why choose the BCM89811B1AWMLG over other BLE chips for computer boards?

  • How does the BCM89811B1AWMLG handle power efficiency in IoT devices?

  • What are common applications for the BCM89811B1AWMLG in computer systems?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Bluetooth Low Energy ICIoT devices, wearablesBluetooth 5.3 (BLE 2Mbps) (Std: 5.0) ▲5.2 (Base) ▲5.3 (Adv) (Bluetooth SIG)Higher data rate for faster transfersRequires updated firmware compatibility
Automotive-grade ICAutomotive systemsOperating Temp: -40°C to 85°C (Std: -20°C to 70°C) ▲-40°C to 85°C (Base) ▲-40°C to 105°C (Adv) (IEC 60068)Reliable in extreme environmentsHigher cost due to advanced materials
QFN Package ICSpace-constrained devicesPackage Size: 5x5mm (Std: 6x6mm) ▲5x5mm (Base) ▲4x4mm (Adv) (JEDEC MO-189)Compact design saves PCB spaceRequires precise manufacturing
Low Power Consumption ICBattery-operated devicesActive Current: 15mA (Std) ▲10mA (Base) ▲7mA (Adv) (lower is better, IEC 60068)Extended battery lifePotential performance trade-offs
IoT Communication ICSmart home, industrial IoTRange: 100m (Std) ▲150m (Base) ▲200m (Adv) (open field, FCC Part 15)Longer range for large setupsHigher power consumption at max range
Customizable ICCustom IoT solutionsProgrammable Profiles: 5 (Std) ▲8 (Base) ▲12 (Adv) (Bluetooth SIG profiles)Flexibility for diverse applicationsIncreased development complexity

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