All categories
Featured selections
Trade Assurance
Buyer Central
Help Center
Get the app
Become a supplier

BGA Reballing Kit for PS3 IC Chip Reballing Stencils Template Kit for Gamevideo PSP PS3 WII XBOX GPU CPU Reballing Repair

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Precision Stenciling: Designed for the reballing and soldering processes, this BGA Reballing Kit ensures precise placement of solder paste or balls onto electronic components, crucial for repairs and refurbishments.
  • Versatile Application: Specifically created for use with gaming consoles like PS3, PSP, WII, and XBOX, as well as GPU and CPU reballing, catering to a wide range of electronic devices.

Key features

  • 1. Advanced Material Technology

  • With corrosion-resistant stainless steel, these templates ensure long-lasting durability and precision in demanding soldering environments.

  • 2. Precision Interactive Design

  • With a meticulously arranged grid of holes, you can achieve uniform solder application, enhancing the accuracy of your electronic repairs.

  • 3. High Performance Parameters

  • With optimized template design, experience ~20% faster reballing processes compared to traditional methods* [*Disclaimer: Based on internal testing; actual results may vary].

  • 4. Versatile Scenario Solutions

  • With customizable templates, you can adapt to various electronic components, making it ideal for both home and commercial electronic repair needs.

  • 5. Adherence to Certification Standards

  • With steel material that meets industry standards, ensure product reliability and safety in electronic manufacturing and repair.

Product details

BGA Reballing Kit for PS3 IC Chip Reballing Stencils Template Kit for Gamevideo PSP PS3 WII XBOX GPU CPU Reballing Repair

The BGA Reballing Kit is designed for precision work in electronics manufacturing and repair, specifically tailored for devices like the PS3, PSP, WII, and XBOX. This kit includes a variety of stencil templates that facilitate the reballing and soldering processes, ensuring accuracy and efficiency in component placement.

Technical specifications

FeatureSpecificationBenefit
MaterialStainless SteelEnsures durability and precision in soldering tasks
StyleRectangular with grid patternGuarantees uniform application of solder
CapabilityReballing/SolderingAllows precise component repair and refurbishment
CustomizationAdjustable template sizesFits various electronic components and models
PackingCarton BoxProvides secure storage and transport

Customization guide

Templates can be customized to fit specific component pads, accommodating various sizes and shapes to meet diverse electronic repair needs.

Get inspired

Unlock the full potential of your electronic repair toolkit with the BGA Reballing Kit. Designed for those who demand precision and reliability, this kit is your gateway to flawless repairs and refurbishments.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Grid PatternStandard+15% Precision+30% Precision
DurabilityBasic SteelEnhanced SteelPremium Steel
CustomizationFixed SizesAdjustableFully Custom

Supplier's note

The Pro version's precision grid pattern – 30% more accurate than industry standards – ensures solder is applied with unmatched accuracy, crucial for high-stakes repairs. Its premium steel composition offers unparalleled durability, making it ideal for regular use in professional environments. When choosing your model, consider the frequency and complexity of your repair tasks; the Pro Model is perfect for expert technicians requiring utmost precision, while the Base Model is suitable for less frequent, standard repairs.

Frequently asked questions

  • Which BGA reballing kit model is best suited for PS3 repairs?

  • How do I maintain and care for my BGA stencil templates?

  • What is the advantage of using stainless steel BGA stencils over other materials?

  • Can the BGA reballing templates be customized for different electronic components?

  • Are the materials used in the BGA reballing kit FDA-approved for safety?

  • What unique features does the BGA Reballing Tool Kit offer for gaming console repairs?

  • How do I use the BGA stencil templates for soldering in electronic repairs?

  • Is the BGA reballing kit compatible with CPU and GPU repairs?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
BGA Reballing KitElectronic RepairsStainless steel construction (durable material)Precision in solder applicationRequires skilled handling
Soldering TemplatesElectronics ManufacturingCustomizable grid patterns (versatile use)Accurate component alignmentLimited to specific device models
Reballing StencilsGaming Console RepairMetal with precise holes (consistent soldering)Enhances reusability of componentsPotentially time-consuming process
Stencil KitsPCB AssemblyUniform hole spacing (ensures uniform solder)Improved reliability of connectionsInitial setup can be complex
Repair ToolsCPU/GPU ReballingCompatible with various ICs (multi-device use)Facilitates component refurbishmentLimited by stencil availability
Welding SuppliesIC Chip ReplacementCarton box packaging (protective storage)Easy transportation and storagePackaging may not be robust enough

Related searches

The Product Description is generated by third-party, and Alibaba.com is not liable for any risks related to inaccuracies or the infringement of third-party rights.

The information in this Product Description may differ from the details on the product listing page on Alibaba.com. Additionally, the contents may not be updated in real-time with the product listing page on Alibaba.com, and there may be delays in reflecting the most updated information. The description on product listing page takes precedence. You shall not rely on this Product Description in making transaction decisions.

The comparison data is based on manufacturer information and industry standards. Actual results may vary depending on individual use cases. It is advisable to verify details with the supplier for the most accurate information.