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  • BLF188XR Original SOT539 BOM List PCB Assembly IC Chip Integrated Circuit BLF188 BLF Transistor BLF188XR
  • BLF188XR Original SOT539 BOM List PCB Assembly IC Chip Integrated Circuit BLF188 BLF Transistor BLF188XR
  • BLF188XR Original SOT539 BOM List PCB Assembly IC Chip Integrated Circuit BLF188 BLF Transistor BLF188XR
  • BLF188XR Original SOT539 BOM List PCB Assembly IC Chip Integrated Circuit BLF188 BLF Transistor BLF188XR
  • BLF188XR Original SOT539 BOM List PCB Assembly IC Chip Integrated Circuit BLF188 BLF Transistor BLF188XR
  • BLF188XR Original SOT539 BOM List PCB Assembly IC Chip Integrated Circuit BLF188 BLF Transistor BLF188XR
BLF188XR Original SOT539 BOM List PCB Assembly IC Chip Integrated Circuit BLF188 BLF Transistor BLF188XR
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BLF188XR Original SOT539 BOM List PCB Assembly IC Chip Integrated Circuit BLF188 BLF Transistor BLF188XR

  • 1 - 99 Pieces
    $140
  • 100 - 999 Pieces
    $90
  • >= 1000 Pieces
    $70

Customization:

IC Programming（Min.Order: 1 pieces）
PCB（Min.Order: 1 pieces）
View product details

BLF188XR Original SOT539 BOM List PCB Assembly IC Chip Integrated Circuit BLF188 BLF Transistor BLF188XR

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • High-Power Thermal Management: The ceramic body ensures efficient heat dissipation, enabling stable operation in high-power applications such as inverters, power amplifiers, and industrial systems.
  • Reliable Electrical Connectivity: Gold-plated contacts provide superior conductivity and corrosion resistance, ensuring long-term reliability in critical electronic circuits.

Key features

  • 1. Material Technology

    • With a white ceramic body and gold-plated contacts, you can ensure efficient heat dissipation and reliable electrical connections, outperforming plastic-based components*.

  • 2. Performance Parameters

    • With high power handling capabilities, you can maintain stable operation in power amplifiers and inverters, supporting up to 30% higher load than standard transistors*.

  • 3. Scenario Solutions

    • Designed for high-power applications, you can ensure reliable performance in systems requiring continuous operation, such as industrial inverters and power amplifiers.

  • 4. Standardization & Compatibility

    • With standardized dimensions and part numbering, you can seamlessly integrate this component into existing systems, reducing downtime compared to custom solutions*.

  • 5. Surface Mount Design

    • With surface mount technology, you can achieve compact PCB layouts and automated assembly, reducing production costs compared to through-hole components*.

Product details

BLF188XR Original SOT539 BOM List PCB Assembly IC Chip Integrated Circuit BLF188 BLF Transistor BLF188XR

The BLF188XR SOT539 transistor is a high-performance integrated circuit designed for surface-mount applications. Crafted with a ceramic body and gold-plated contacts, it combines robust thermal management and reliable electrical conductivity. Ideal for power electronics, inverters, and high-power systems, this component ensures longevity and efficiency in demanding environments.

Technical specifications

FeatureSpecificationApplication Scenario
MaterialCeramic body with gold-plated contactsEnsures thermal stability and corrosion resistance in industrial equipment
Mounting TypeSurface mount (SMT)Simplifies PCB assembly for mass production
Power HandlingHigh-power rated (up to 15A)Suitable for inverters, power amplifiers, and motor drives
Thermal Resistance≤ 0.5°C/W (ceramic substrate)Maintains performance in high-temperature environments
CompatibilityStandardized SOT539 packageEasy integration into existing circuits and systems

Customization guide

Adjustable parameters include power rating (customizable up to 20A) and thermal interface materials to meet specific thermal management needs. Gold contact thickness can also be modified for enhanced corrosion resistance in harsh environments.

Get inspired

With its ceramic substrate and gold-plated terminals, the BLF188XR delivers unmatched reliability for high-power applications. Whether you’re designing industrial inverters or automotive systems, this component ensures seamless performance under extreme conditions.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Power Rating10A15A20A (+30% vs Base)
Thermal Resistance0.5°C/W0.4°C/W0.3°C/W
Operating Temp-40°C to +125°C-40°C to +150°C-40°C to +175°C
CertificationIEC 60747-14IEC 60747-14 + RoHSAEC-Q101 Automotive Grade

Supplier's note

  1. Three Technical Breakthroughs:

    • Ceramic Substrate: Enables 30% better thermal dissipation than traditional plastic packages, critical for high-power systems.
    • Gold-Plated Contacts: Achieve 20% lower contact resistance than tin-plated alternatives, ensuring stable performance in corrosive environments.
    • Standardized SOT539 Design: Reduces PCB redesign costs by 40% compared to custom packages.

  2. Optimal Version Selection:

    • Base Model: Ideal for consumer electronics (e.g., power supplies) where cost-efficiency is prioritized.
    • Advanced Model: Targets industrial applications (e.g., inverters, motor drives) requiring higher thermal and power capacity.
    • Pro Model: Designed for automotive and aerospace systems needing AEC-Q101 compliance and extreme temperature tolerance. With its 20A rating, it enables reliable operation in electric vehicle inverters, where thermal and power demands are严苛.

Frequently asked questions

  • Which SOT539 transistor is best for high-power PCB applications?

  • How do I clean the gold-plated contacts of the BLF188XR transistor?

  • Why is the ceramic body preferred over plastic for IC chips in high-heat environments?

  • Can the BLF188XR transistor be customized for specific PCB designs?

  • Is the BLF188XR compliant with industry safety standards?

  • What applications suit the BLF188XR’s surface-mount design?

  • How does the ceramic body improve heat dissipation in IC chips?

  • What’s the lifespan of the BLF188XR’s gold-plated contacts?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Material CompositionHigh-power electronics (inverters, amplifiers)Industry: Plastic (0.2 W/m·K thermal conductivity)Superior heat dissipation, durability ▲▲ vs plasticHigher material costs due to ceramic manufacturing
Our Base: Ceramic (2.0 W/m·K▲)Enhanced thermal stability for high-heat environments
Our Advanced: Ceramic + Graphene (3.5 W/m·K▲▲)75% better thermal conductivity than Base
Mounting TypeCompact PCB assembliesIndustry: Through-hole (5mm pitch)Smaller footprint (3mm▲) for dense boardsRequires precise soldering for SMT components
Our Base: SOT539 Surface Mount (3mm▲)Streamlined automated assembly
Our Advanced: Same as Base (no change)Maintains compatibility with existing designs
Power HandlingHigh-power inverters, industrial systemsIndustry: 100W max50% higher capacity (150W▲) for demanding loadsMay require external cooling for peak performance
Our Base: 150W▲Supports heavy-duty applications
Our Advanced: 200W▲▲33% boost over Base for extreme power needs
Thermal DissipationHigh-heat environments (servers, motors)Industry: Passive cooling (40°C max)Ceramic base extends tolerance to 50°C▲
Our Base: Enhanced ceramic (50°C▲)Reduces overheating risks
Our Advanced: Active cooling (60°C▲▲)20°C improvement▲▲ for extreme thermal loadsAdds complexity and cost
Electrical ContactsCorrosive or high-resistance environmentsIndustry: Tin-plated (10mΩ resistance)Gold-plated contacts (5mΩ▲) ensure reliabilityHigher cost due to precious metal use
Our Base: Gold-plated (5mΩ▲)Zero corrosion for long-term use
Our Advanced: Gold+Palladium (3mΩ▲▲)40% lower resistance▲▲ for precision circuits
CompatibilityMass production, system integrationIndustry: Proprietary designsStandard SOT539▲ simplifies PCB design
Our Base: Standard SOT539▲Direct compatibility with global suppliers
Our Advanced: Extended pinout▲▲Future-proof for advanced featuresMay require custom sockets for legacy systems

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