Package Type | High-speed digital systems, PCB assembly | Industry Standard: TQFP (208-pin) Our Base: 40-pin LQFP (14mm×14mm) Our Advanced: 40-pin LQFP+ (14mm×14mm, ▲ enhanced thermal vias) | ▲ Base: Compact size reduces PCB footprint. ▲▲ Advanced: 30% better heat dissipation (per JEDEC JESD51-2). | Industry Standard: Bulkier; Advanced: Slightly higher cost due to thermal features. |
Pin Count | Complex systems requiring dense I/O | Industry Standard: 28 pins (e.g., SOIC) Our Base: 40 pins ▲ Our Advanced: 40 pins + 8 I/O buffers ▲▲ | ▲ Base: Supports 40 signals for multi-functional systems. ▲▲ Advanced: 15% faster signal routing (per TIA/EIA-604). | Limited to 40 pins; Advanced requires advanced PCB design tools. |
Operating Temperature | Harsh industrial environments | Industry Standard: -40°C to +85°C Our Base: -40°C to +105°C ▲ Our Advanced: -55°C to +125°C ▲▲ | ▲ Base: 20°C wider range than standard. ▲▲ Advanced: Military-grade (-55°C to +125°C, per MIL-STD-883). | Advanced version may need additional cooling in extreme conditions. |
Data Rate | High-speed networking, IoT gateways | Industry Standard: 100 Mbps Our Base: 200 Mbps ▲ Our Advanced: 500 Mbps ▲▲ (per IEEE 802.3) | ▲ Base: 2x faster than standard. ▲▲ Advanced: Supports 4K video streaming (500 Mbps ≈ 62.5 MB/s). | Base: May lag in 5G applications; Advanced: Requires compatible hardware. |
Power Consumption | Battery-powered devices | Industry Standard: 300 mW (at 100 Mbps) Our Base: 220 mW ▲ Our Advanced: 150 mW ▲▲ (per IEC 62301) | ▲ Base: 27% lower power than standard. ▲▲ Advanced: 50% lower power at 500 Mbps. | Advanced: May sacrifice peak performance for efficiency. |
Thermal Resistance | High-power applications | Industry Standard: 80°C/W Our Base: 65°C/W ▲ Our Advanced: 45°C/W ▲▲ (per JEDEC JESD51-12) | ▲ Base: 19% cooler operation. ▲▲ Advanced: 44% lower thermal resistance (ideal for 24/7 servers). | Advanced: Requires heatsinks for optimal performance. |