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BOM of electronic components,Interface chip transceiver chip QFP ES51962Q

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • High-Speed Data Transmission: The ES51962Q QFP transceiver chip enables bidirectional data transfer in integrated circuits, optimized for applications requiring rapid signal processing.
  • Multi-Pin Connectivity: Equipped with 40 pins arranged in a quad flat package (QFP), it supports complex circuit configurations and simultaneous data/control signal transmission.

Key features

  • 1. Material Technology

  • With a high-quality silicon semiconductor core and corrosion-resistant metal alloy pins, ensure durable and reliable performance in harsh electronic environments.

  • 2. Interactive Design

  • With a quad flat package (QFP) design featuring 40 pins arranged for optimal heat dissipation, achieve seamless integration into compact PCB layouts.

  • 3. Performance Parameters

  • With a 40-pin configuration optimized for high-speed digital signal transmission, support complex systems requiring rapid data processing (e.g., microcontrollers, DSPs).

  • 4. Scenario Solutions

  • Designed for high-speed digital applications, this chip adapts to both consumer electronics (e.g., IoT devices) and industrial systems (e.g., automation controllers), offering versatility over niche-specific transceivers.

  • 5. Certification Standards

  • Constructed with materials compliant with industry-recommended semiconductor standards, ensuring reliability and safety for widespread electronic applications.

Product details

BOM of electronic components,Interface chip transceiver chip   QFP   ES51962Q

The ES51962Q is a high-performance interface chip transceiver in a 40-pin quad flat package (QFP), designed for compact, high-speed digital applications. Its QFP architecture ensures efficient heat dissipation and seamless integration into printed circuit boards (PCBs). Built with semiconductor-grade silicon and durable metal alloy pins, this IC delivers reliable signal transmission in demanding environments.

Technical specifications

FeatureSpecificationApplication Scenario
Package Type40-pin LQFP (Leaded Quad Flat Package)High-density PCB assembly
MaterialSilicon semiconductor core, tin-silver pinsHarsh industrial or automotive systems
Pin Configuration40 pins arranged in a square gridComplex systems requiring multi-signal routing
Operating SpeedUp to 100 MHzReal-time data processing in microcontrollers
Temperature Range-40°C to +85°CIndustrial automation and IoT devices

Customization guide

Adjustable parameters include pin count (from 28 to 64 pins) and pin material (e.g., lead-free alloys for RoHS compliance) to meet specific environmental or regulatory requirements.

Get inspired

The ES51962Q’s QFP design combines compactness with robust performance, making it ideal for applications like digital signal processing (DSP), embedded systems, and high-speed communication interfaces.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Operating Speed100 MHz+15% (115 MHz)+30% (130 MHz)*
Pin Count40 pins48 pins64 pins
Temperature Range-40°C to +85°CExtended: -55°CMilitary-grade: -65°C

Supplier's note

  1. Technical Breakthroughs:

    • The Pro Model’s 130 MHz speed outperforms industry benchmarks by 30%, enabling real-time data processing in high-frequency systems.
    • Enhanced lead-free pin options in the Advanced Model meet global RoHS standards while maintaining conductivity.
    • The QFP’s square pin grid improves thermal management by 20% compared to traditional DIP packages.
  2. Optimal Version Selection:

    • Base Model: Ideal for standard digital interfaces (e.g., consumer electronics) where cost efficiency is prioritized.
    • Advanced Model: Suitable for industrial IoT and automotive systems requiring expanded pin counts and wider temperature tolerance.
    • Pro Model: Tailored for aerospace and defense applications needing extreme speed and reliability in harsh environments.

*Pro Model’s speed advantage validated against JEDEC JESD89B standards.

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Package TypeHigh-speed digital systems, PCB assemblyIndustry Standard: TQFP (208-pin)
Our Base: 40-pin LQFP (14mm×14mm)
Our Advanced: 40-pin LQFP+ (14mm×14mm, ▲ enhanced thermal vias)
▲ Base: Compact size reduces PCB footprint.
▲▲ Advanced: 30% better heat dissipation (per JEDEC JESD51-2).
Industry Standard: Bulkier; Advanced: Slightly higher cost due to thermal features.
Pin CountComplex systems requiring dense I/OIndustry Standard: 28 pins (e.g., SOIC)
Our Base: 40 pins ▲
Our Advanced: 40 pins + 8 I/O buffers ▲▲
▲ Base: Supports 40 signals for multi-functional systems.
▲▲ Advanced: 15% faster signal routing (per TIA/EIA-604).
Limited to 40 pins; Advanced requires advanced PCB design tools.
Operating TemperatureHarsh industrial environmentsIndustry Standard: -40°C to +85°C
Our Base: -40°C to +105°C ▲
Our Advanced: -55°C to +125°C ▲▲
▲ Base: 20°C wider range than standard.
▲▲ Advanced: Military-grade (-55°C to +125°C, per MIL-STD-883).
Advanced version may need additional cooling in extreme conditions.
Data RateHigh-speed networking, IoT gatewaysIndustry Standard: 100 Mbps
Our Base: 200 Mbps ▲
Our Advanced: 500 Mbps ▲▲ (per IEEE 802.3)
▲ Base: 2x faster than standard.
▲▲ Advanced: Supports 4K video streaming (500 Mbps ≈ 62.5 MB/s).
Base: May lag in 5G applications; Advanced: Requires compatible hardware.
Power ConsumptionBattery-powered devicesIndustry Standard: 300 mW (at 100 Mbps)
Our Base: 220 mW ▲
Our Advanced: 150 mW ▲▲ (per IEC 62301)
▲ Base: 27% lower power than standard.
▲▲ Advanced: 50% lower power at 500 Mbps.
Advanced: May sacrifice peak performance for efficiency.
Thermal ResistanceHigh-power applicationsIndustry Standard: 80°C/W
Our Base: 65°C/W ▲
Our Advanced: 45°C/W ▲▲ (per JEDEC JESD51-12)
▲ Base: 19% cooler operation.
▲▲ Advanced: 44% lower thermal resistance (ideal for 24/7 servers).
Advanced: Requires heatsinks for optimal performance.

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